Muneharu Ohara

Person

Hasuda, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper foil for a printed circuit board, a process and an apparatus...
- Patent number 5,997,710
- Issue date Dec 7, 1999
- Mitsui Mining & Smelting Co., Ltd.
- Muneharu Ohara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 5,959,256
- Issue date Sep 28, 1999
- Mitsui Mining and Smelting Co., Ltd.
- Muneo Saida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for a printed circuit board, a process and an apparatus...
- Patent number 5,833,819
- Issue date Nov 10, 1998
- Mitsui Mining & Smelting Co., Ltd.
- Muneharu Ohara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of making multilayer printed wiring board
- Patent number 5,718,039
- Issue date Feb 17, 1998
- Mitsui Mining & Smelting Co., Ltd.
- Muneo Saida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for copper foils and an adhesive-applied copper foil
- Patent number 5,674,611
- Issue date Oct 7, 1997
- Mitsui Mining Smelting Co., Ltd.
- Muneo Saida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Printed circuit inner-layer copper foil and process for producing t...
- Patent number 5,482,784
- Issue date Jan 9, 1996
- Mitsui Mining & Smelting Co., Ltd.
- Muneharu Ohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Muneharu Ohara

Person

Patents Grantslast 30 patents

Copper foil for a printed circuit board, a process and an apparatus...

Multilayer printed wiring board

Copper foil for a printed circuit board, a process and an apparatus...

Method of making multilayer printed wiring board

Adhesive for copper foils and an adhesive-applied copper foil

Printed circuit inner-layer copper foil and process for producing t...