Munehide SAIMEN

Person

Suwa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
MEMS device, liquid ejecting head, liquid ejecting apparatus, and M...
- Patent number 10,377,134
- Issue date Aug 13, 2019
- Seiko Epson Corporation
- Motoki Takabe
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Piezoelectric device, liquid ejecting head, and liquid ejecting app...
- Patent number 10,029,459
- Issue date Jul 24, 2018
- Seiko Epson Corporation
- Eiju Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device, liquid ejecting head, and liquid ejecting apparatus
- Patent number 9,969,162
- Issue date May 15, 2018
- Seiko Epson Corporation
- Munehide Saimen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Piezoelectric device, liquid ejecting head, and liquid ejecting app...
- Patent number 9,919,523
- Issue date Mar 20, 2018
- Seiko Epson Corporation
- Eiju Hirai
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Piezoelectric device, liquid ejecting head, and liquid ejecting app...
- Patent number 9,914,301
- Issue date Mar 13, 2018
- Seiko Epson Corporation
- Eiju Hirai
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
MEMS device and liquid ejecting head
- Patent number 9,908,331
- Issue date Mar 6, 2018
- Seiko Epson Corporation
- Eiju Hirai
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Piezoelectric device, liquid ejecting head, and liquid ejecting app...
- Patent number 9,844,939
- Issue date Dec 19, 2017
- Seiko Epson Corporation
- Eiju Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device, liquid ejecting head, and liquid ejecting apparatus
- Patent number 9,770,907
- Issue date Sep 26, 2017
- Seiko Epson Corporation
- Katsutomo Tsukahara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electro-optic device and electronic apparatus
- Patent number 9,684,197
- Issue date Jun 20, 2017
- Seiko Epson Corporation
- Munehide Saimen
- G02 - OPTICS
Information Patent Grant
Electrooptic substrate, electrooptic device, and electronic apparatus
- Patent number 8,675,372
- Issue date Mar 18, 2014
- Seiko Epson Corporation
- Munehide Saimen
- G02 - OPTICS
Information Patent Grant
Method for manufacturing flexible substrate and flexible substrate...
- Patent number 8,640,582
- Issue date Feb 4, 2014
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electro-optical device, electro-optical panel, and electronic appar...
- Patent number 8,391,020
- Issue date Mar 5, 2013
- Seiko Epson Corporation
- Munehide Saimen
- G02 - OPTICS
Information Patent Grant
Electro-optical device and electronic apparatus
- Patent number 8,289,492
- Issue date Oct 16, 2012
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing electro-optical device using anisotropic conduc...
- Patent number 8,016,181
- Issue date Sep 13, 2011
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring substrate having sheet
- Patent number 7,901,528
- Issue date Mar 8, 2011
- Seiko Epson Corporation
- Munehide Saimen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic part and method for manufacturing the same
- Patent number 7,704,793
- Issue date Apr 27, 2010
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,656,026
- Issue date Feb 2, 2010
- Seiko Epson Corporation
- Yoshiharu Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and manufacturing apparatus
- Patent number 7,582,955
- Issue date Sep 1, 2009
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component including reinforcing member
- Patent number 7,535,108
- Issue date May 19, 2009
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device including a protrudi...
- Patent number 7,390,733
- Issue date Jun 24, 2008
- Seiko Epson Corporation
- Munehide Saimen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic part and wiring substrate
- Patent number 7,385,142
- Issue date Jun 10, 2008
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part having reinforcing member
- Patent number 7,348,679
- Issue date Mar 25, 2008
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and manufacturing apparatus
- Patent number 7,323,365
- Issue date Jan 29, 2008
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and manufacturing apparatus
- Patent number 7,316,939
- Issue date Jan 8, 2008
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and manufacturing apparatus
- Patent number 7,282,389
- Issue date Oct 16, 2007
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate, semiconductor module and method of manufacturing...
- Patent number 7,190,065
- Issue date Mar 13, 2007
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APP...
- Publication number 20180065365
- Publication date Mar 8, 2018
- SEIKO EPSON CORPORATION
- Eiju HIRAI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND M...
- Publication number 20170368826
- Publication date Dec 28, 2017
- SEIKO EPSON CORPORATION
- Motoki TAKABE
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS
- Publication number 20170313074
- Publication date Nov 2, 2017
- SEIKO EPSON CORPORATION
- Munehide SAIMEN
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APP...
- Publication number 20170266972
- Publication date Sep 21, 2017
- SEIKO EPSON CORPORATION
- Eiju HIRAI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APP...
- Publication number 20170266971
- Publication date Sep 21, 2017
- SEIKO EPSON CORPORATION
- Eiju HIRAI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APP...
- Publication number 20170225464
- Publication date Aug 10, 2017
- SEIKO EPSON CORPORATION
- Eiju HIRAI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MEMS DEVICE AND LIQUID EJECTING HEAD
- Publication number 20170217175
- Publication date Aug 3, 2017
- SEIKO EPSON CORPORATION
- Eiju HIRAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS
- Publication number 20170144442
- Publication date May 25, 2017
- SEIKO EPSON CORPORATION
- Katsutomo TSUKAHARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRO-OPTIC DEVICE AND ELECTRONIC APPARATUS
- Publication number 20150160505
- Publication date Jun 11, 2015
- SEIKO EPSON CORPORATION
- Munehide Saimen
- G02 - OPTICS
Information Patent Application
ELECTROOPTIC SUBSTRATE, ELECTROOPTIC DEVICE, AND ELECTRONIC APPARATUS
- Publication number 20120236514
- Publication date Sep 20, 2012
- SEIKO EPSON CORPORATION
- Munehide Saimen
- G02 - OPTICS
Information Patent Application
ELECTRO-OPTICAL DEVICE, ELECTRO-OPTICAL PANEL, AND ELECTRONIC APPAR...
- Publication number 20110134621
- Publication date Jun 9, 2011
- SEIKO EPSON CORPORATION
- Munehide Saimen
- G02 - OPTICS
Information Patent Application
ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS
- Publication number 20110122356
- Publication date May 26, 2011
- SEIKO EPSON CORPORATION
- Munehide SAIMEN
- G02 - OPTICS
Information Patent Application
CONDUCTIVE ADHESIVE FILM, METHOD OF PRODUCING CONDUCTIVE ADHESIVE F...
- Publication number 20090208731
- Publication date Aug 20, 2009
- SEIKO EPSON CORPORATION
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING ELECTRO-OPTICAL DEVICE AND ELECTRO-OPTICAL DEVICE
- Publication number 20090197111
- Publication date Aug 6, 2009
- SEIKO EPSON CORPORATION
- Munehide Saimen
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE SUBSTRATE AND FLEXIBLE SUBSTRATE...
- Publication number 20090178522
- Publication date Jul 16, 2009
- SEIKO EPSON CORPORATION
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090020867
- Publication date Jan 22, 2009
- SEIKO EPSON CORPORATION
- Yoshiharu OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method and manufacturing apparatus
- Publication number 20080178723
- Publication date Jul 31, 2008
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic part and method for manufacturing the same
- Publication number 20080132001
- Publication date Jun 5, 2008
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device manufacturing method and manufacturing apparatus
- Publication number 20080090331
- Publication date Apr 17, 2008
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE HAVING SHEET
- Publication number 20080078491
- Publication date Apr 3, 2008
- SEIKO EPSON CORPORATION
- Munehide SAIMEN
- B32 - LAYERED PRODUCTS
Information Patent Application
Electronic part and method for manufacturing the same
- Publication number 20060108699
- Publication date May 25, 2006
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component and method for manufacturing the same
- Publication number 20060103027
- Publication date May 18, 2006
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of electronic part and wiring substrate
- Publication number 20060102382
- Publication date May 18, 2006
- Seiko Epson Corporation
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device manufacturing method and manufacturing apparatus
- Publication number 20050194693
- Publication date Sep 8, 2005
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device manufacturing method and manufacturing apparatus
- Publication number 20050186702
- Publication date Aug 25, 2005
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device manufacturing method and manufacturing apparatus
- Publication number 20050121779
- Publication date Jun 9, 2005
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, semiconductor module, and method of manufactu...
- Publication number 20050006762
- Publication date Jan 13, 2005
- SEIKO EPSON CORPORATION
- Munehide Saimen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate, semiconductor module and method of manufacturing...
- Publication number 20050006763
- Publication date Jan 13, 2005
- SEIKO EPSON CORPORATION
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Munehide SAIMEN

Person

Patents Grantslast 30 patents

MEMS device, liquid ejecting head, liquid ejecting apparatus, and M...

Piezoelectric device, liquid ejecting head, and liquid ejecting app...

MEMS device, liquid ejecting head, and liquid ejecting apparatus

Piezoelectric device, liquid ejecting head, and liquid ejecting app...

Piezoelectric device, liquid ejecting head, and liquid ejecting app...

MEMS device and liquid ejecting head

Piezoelectric device, liquid ejecting head, and liquid ejecting app...

MEMS device, liquid ejecting head, and liquid ejecting apparatus

Electro-optic device and electronic apparatus

Electrooptic substrate, electrooptic device, and electronic apparatus

Method for manufacturing flexible substrate and flexible substrate...

Electro-optical device, electro-optical panel, and electronic appar...

Electro-optical device and electronic apparatus

Method of producing electro-optical device using anisotropic conduc...

Method for manufacturing wiring substrate having sheet

Electronic part and method for manufacturing the same

Semiconductor device

Semiconductor device manufacturing method and manufacturing apparatus

Electronic component including reinforcing member

Method of manufacturing a semiconductor device including a protrudi...

Manufacturing method of electronic part and wiring substrate

Electronic part having reinforcing member

Semiconductor device manufacturing method and manufacturing apparatus

Semiconductor device manufacturing method and manufacturing apparatus

Semiconductor device manufacturing method and manufacturing apparatus

Circuit substrate, semiconductor module and method of manufacturing...

Patents Applicationslast 30 patents

PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APP...

MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND M...

MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS

PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APP...

PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APP...

PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APP...

MEMS DEVICE AND LIQUID EJECTING HEAD

MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS

ELECTRO-OPTIC DEVICE AND ELECTRONIC APPARATUS

ELECTROOPTIC SUBSTRATE, ELECTROOPTIC DEVICE, AND ELECTRONIC APPARATUS

ELECTRO-OPTICAL DEVICE, ELECTRO-OPTICAL PANEL, AND ELECTRONIC APPAR...

ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS

CONDUCTIVE ADHESIVE FILM, METHOD OF PRODUCING CONDUCTIVE ADHESIVE F...

METHOD OF PRODUCING ELECTRO-OPTICAL DEVICE AND ELECTRO-OPTICAL DEVICE

METHOD FOR MANUFACTURING FLEXIBLE SUBSTRATE AND FLEXIBLE SUBSTRATE...

SEMICONDUCTOR DEVICE

Semiconductor device manufacturing method and manufacturing apparatus

Electronic part and method for manufacturing the same

Semiconductor device manufacturing method and manufacturing apparatus

METHOD FOR MANUFACTURING WIRING SUBSTRATE HAVING SHEET

Electronic part and method for manufacturing the same

Electronic component and method for manufacturing the same

Manufacturing method of electronic part and wiring substrate

Semiconductor device manufacturing method and manufacturing apparatus

Semiconductor device manufacturing method and manufacturing apparatus

Semiconductor device manufacturing method and manufacturing apparatus

Semiconductor device, semiconductor module, and method of manufactu...

Circuit substrate, semiconductor module and method of manufacturing...