Munehiro Hatai

Person

Mishima-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive for electronic components, and manufacturing method for se...
- Patent number 9,011,629
- Issue date Apr 21, 2015
- Sekisui Chemical Co., Ltd.
- Carl Alvin Dilao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing semiconductor chip
- Patent number 7,335,578
- Issue date Feb 26, 2008
- Sekisui Chemical Co., Ltd.
- Masateru Fukuoka
- B24 - GRINDING POLISHING
Information Patent Grant
IC chip manufacturing method
- Patent number 6,939,741
- Issue date Sep 6, 2005
- Sekisui Chemical Co., Ltd.
- Masateru Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photocurable pressure-sensitive adhesive composition and its sheet
- Patent number 6,641,912
- Issue date Nov 4, 2003
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
RADIO WAVE REFLECTOR
- Publication number 20250105525
- Publication date Mar 27, 2025
- Sekisui Chemical Co., Ltd
- Hiroyuki NOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE, CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING LAMIN...
- Publication number 20230245936
- Publication date Aug 3, 2023
- Sekisui Chemical Co., Ltd
- Taro SHIOJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FOR ELECTRONIC COMPONENTS, AND MANUFACTURING METHOD FOR SE...
- Publication number 20130237018
- Publication date Sep 12, 2013
- Sekisui Chemical Co., Ltd
- Carl Alvin Dilao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Ic Chip Manufacturing Method
- Publication number 20080314507
- Publication date Dec 25, 2008
- Munehiro Hatai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for manufacturing semiconductor chip
- Publication number 20070037364
- Publication date Feb 15, 2007
- Daihei Sugita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive material, method for peeling adhesive material, and pressu...
- Publication number 20060269715
- Publication date Nov 30, 2006
- Sekisui Chemical Co., Ltd.
- Munehiro Hatai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive material, method for peeling adhesive material, and pressu...
- Publication number 20050173051
- Publication date Aug 11, 2005
- Munehiro Hatai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive substance, adhesive product, and connected structure
- Publication number 20050054758
- Publication date Mar 10, 2005
- Munehiro Hatai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive material, method for unsticking adhesive material and boun...
- Publication number 20040261943
- Publication date Dec 30, 2004
- Masateru Fukuoka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for manufacturing semiconductor chip
- Publication number 20040259332
- Publication date Dec 23, 2004
- Masateru Fukuoka
- B24 - GRINDING POLISHING
Information Patent Application
Pressure sensitive adhesive double coated tape and method for produ...
- Publication number 20040248382
- Publication date Dec 9, 2004
- Munehiro Hatai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Ic chip manufacturing method
- Publication number 20040185639
- Publication date Sep 23, 2004
- Masateru Fukuoka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Photocurable Pressure- Sensitive Adhesive Composition And Its sheet
- Publication number 20030040550
- Publication date Feb 27, 2003
- Hideaki Ishizawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Munehiro Hatai

Person

Patents Grantslast 30 patents

Adhesive for electronic components, and manufacturing method for se...

Method for manufacturing semiconductor chip

IC chip manufacturing method

Photocurable pressure-sensitive adhesive composition and its sheet

Patents Applicationslast 30 patents

RADIO WAVE REFLECTOR

LAMINATE, CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING LAMIN...

ADHESIVE FOR ELECTRONIC COMPONENTS, AND MANUFACTURING METHOD FOR SE...

Ic Chip Manufacturing Method

Method for manufacturing semiconductor chip

Adhesive material, method for peeling adhesive material, and pressu...

Adhesive material, method for peeling adhesive material, and pressu...

Adhesive substance, adhesive product, and connected structure

Adhesive material, method for unsticking adhesive material and boun...

Method for manufacturing semiconductor chip

Pressure sensitive adhesive double coated tape and method for produ...

Ic chip manufacturing method

Photocurable Pressure- Sensitive Adhesive Composition And Its sheet