Munehiro Toyama

Person

Tsukubashi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Grid array connection device and method
- Patent number 9,966,351
- Issue date May 8, 2018
- Intel Corporation
- Munehiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grid array connection device and method
- Patent number 9,449,936
- Issue date Sep 20, 2016
- Intel Corporation
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing underfill keep out zone on substrate used in electronic de...
- Patent number 8,362,627
- Issue date Jan 29, 2013
- Intel Corporation
- Shripad Gokhale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding device in substrate cavity
- Patent number 8,115,307
- Issue date Feb 14, 2012
- Intel Corporation
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grid array connection device and method
- Patent number 7,915,060
- Issue date Mar 29, 2011
- Intel Corporation
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing underfill keep out zone on substrate used in electronic de...
- Patent number 7,875,503
- Issue date Jan 25, 2011
- Intel Corporation
- Shripad Gokhale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grid array connection device and method
- Patent number 7,670,951
- Issue date Mar 2, 2010
- Intel Corporation
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding device in substrate cavity
- Patent number 7,592,202
- Issue date Sep 22, 2009
- Intel Corporation
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of substrate manufacture that decreases the package resistance
- Patent number 7,432,202
- Issue date Oct 7, 2008
- Intel Corporation
- Bijay S. Saha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
GRID ARRAY CONNECTION DEVICE AND METHOD
- Publication number 20160365325
- Publication date Dec 15, 2016
- Intel Corporation
- Munehiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRID ARRAY CONNECTION DEVICE AND METHOD
- Publication number 20150179600
- Publication date Jun 25, 2015
- Munehiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRID ARRAY CONNECTION DEVICE AND METHOD
- Publication number 20110169167
- Publication date Jul 14, 2011
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCING UNDERFILL KEEP OUT ZONE ON SUBSTRATE USED IN ELECTRONIC DE...
- Publication number 20110084388
- Publication date Apr 14, 2011
- Shripad Gokhale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LGA SUBSTRATE AND METHOD OF MAKING SAME
- Publication number 20100301484
- Publication date Dec 2, 2010
- Omar J. Bchir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRID ARRAY CONNECTION DEVICE AND METHOD
- Publication number 20100148365
- Publication date Jun 17, 2010
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDING DEVICE IN SUBSTRATE CAVITY
- Publication number 20090294992
- Publication date Dec 3, 2009
- Intel Corporation
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LGA SUBSTRATE AND METHOD OF MAKING SAME
- Publication number 20090166858
- Publication date Jul 2, 2009
- Omar J. Bchir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCING UNDERFILL KEEP OUT ZONE ON SUBSTRATE USED IN ELECTRONIC DE...
- Publication number 20080157352
- Publication date Jul 3, 2008
- Shripad Gokhale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding device in substrate cavity
- Publication number 20070232050
- Publication date Oct 4, 2007
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of substrate manufacture that decreases the package resistance
- Publication number 20070148971
- Publication date Jun 28, 2007
- Bijay S. Saha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grid array connection device and method
- Publication number 20060292737
- Publication date Dec 28, 2006
- Munehiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Munehiro Toyama

Person

Patents Grantslast 30 patents

Grid array connection device and method

Grid array connection device and method

Reducing underfill keep out zone on substrate used in electronic de...

Embedding device in substrate cavity

Grid array connection device and method

Reducing underfill keep out zone on substrate used in electronic de...

Grid array connection device and method

Embedding device in substrate cavity

Method of substrate manufacture that decreases the package resistance

Patents Applicationslast 30 patents

GRID ARRAY CONNECTION DEVICE AND METHOD

GRID ARRAY CONNECTION DEVICE AND METHOD

GRID ARRAY CONNECTION DEVICE AND METHOD

REDUCING UNDERFILL KEEP OUT ZONE ON SUBSTRATE USED IN ELECTRONIC DE...

LGA SUBSTRATE AND METHOD OF MAKING SAME

GRID ARRAY CONNECTION DEVICE AND METHOD

EMBEDDING DEVICE IN SUBSTRATE CAVITY

LGA SUBSTRATE AND METHOD OF MAKING SAME

REDUCING UNDERFILL KEEP OUT ZONE ON SUBSTRATE USED IN ELECTRONIC DE...

Embedding device in substrate cavity

Method of substrate manufacture that decreases the package resistance

Grid array connection device and method