Munehisa Kodama

Person

Koshi City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,142,483
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Yoshihiro Kawaguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing system, substrate processing method and comput...
- Patent number 11,929,268
- Issue date Mar 12, 2024
- Tokyo Electron Limited
- Munehisa Kodama
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing system, substrate processing method and comput...
- Patent number 11,858,092
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- Munehisa Kodama
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 11,817,337
- Issue date Nov 14, 2023
- Tokyo Electron Limited
- Munehisa Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,417,543
- Issue date Aug 16, 2022
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer device, substrate processing system, substrate p...
- Patent number 11,120,985
- Issue date Sep 14, 2021
- Tokyo Electron Limited
- Munehisa Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and manufacturing method of substrat...
- Patent number 10,833,045
- Issue date Nov 10, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240379370
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- Yoshihiro KAWAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20240017375
- Publication date Jan 18, 2024
- TOKYO ELECTRON LIMITED
- Takeshi TAMURA
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING APPARATUS
- Publication number 20230364740
- Publication date Nov 16, 2023
- TOKYO ELECTRON LIMITED
- Munehisa KODAMA
- B24 - GRINDING POLISHING
Information Patent Application
THICKNESS MEASURING DEVICE AND THICKNESS MEASURING METHOD
- Publication number 20230341224
- Publication date Oct 26, 2023
- TOKYO ELECTRON LIMITED
- Takeshi TAMURA
- G01 - MEASURING TESTING
Information Patent Application
REMOVING APPARATUS
- Publication number 20230105522
- Publication date Apr 6, 2023
- TOKYO ELECTRON LIMITED
- Takahiro SAKAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230086738
- Publication date Mar 23, 2023
- TOKYO ELECTRON LIMITED
- Tokutarou HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND SUB...
- Publication number 20220277962
- Publication date Sep 1, 2022
- TOKYO ELECTRON LIMITED
- Munehisa KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220234160
- Publication date Jul 28, 2022
- TOKYO ELECTRON LIMITED
- Yohei YAMAWAKI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210391177
- Publication date Dec 16, 2021
- TOKYO ELECTRON LIMITED
- Yoshihiro KAWAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20210327738
- Publication date Oct 21, 2021
- TOKYO ELECTRON LIMITED
- Munehisa KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD AND COMPUT...
- Publication number 20210050241
- Publication date Feb 18, 2021
- TOKYO ELECTRON LIMITED
- Munehisa KODAMA
- B08 - CLEANING
Information Patent Application
SUBSTRATE TRANSFER DEVICE, SUBSTRATE PROCESSING SYSTEM, SUBSTRATE P...
- Publication number 20200306925
- Publication date Oct 1, 2020
- TOKYO ELECTRON LIMITED
- Munehisa KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20200234961
- Publication date Jul 23, 2020
- TOKYO ELECTRON LIMITED
- Takeshi TAMURA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD AND COMPUT...
- Publication number 20200139503
- Publication date May 7, 2020
- TOKYO ELECTRON LIMITED
- Munehisa KODAMA
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING APPARATUS, GRINDING METHOD AND COMPUTER-READABLE RECORDING...
- Publication number 20200130124
- Publication date Apr 30, 2020
- Tokyo Electron Limited
- Takeshi TAMURA
- B24 - GRINDING POLISHING
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20200020553
- Publication date Jan 16, 2020
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SUBSTRAT...
- Publication number 20180342479
- Publication date Nov 29, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS

Munehisa Kodama

Person

Patents Grantslast 30 patents

Substrate processing apparatus and substrate processing method

Substrate processing system, substrate processing method and comput...

Substrate processing system, substrate processing method and comput...

Substrate processing system and substrate processing method

Bonding apparatus and bonding method

Substrate transfer device, substrate processing system, substrate p...

Substrate processing apparatus and manufacturing method of substrat...

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

GRINDING APPARATUS

THICKNESS MEASURING DEVICE AND THICKNESS MEASURING METHOD

REMOVING APPARATUS

BONDING APPARATUS AND BONDING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND SUB...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD AND COMPUT...

SUBSTRATE TRANSFER DEVICE, SUBSTRATE PROCESSING SYSTEM, SUBSTRATE P...

SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD AND COMPUT...

GRINDING APPARATUS, GRINDING METHOD AND COMPUTER-READABLE RECORDING...

BONDING APPARATUS AND BONDING METHOD

SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SUBSTRAT...