Munenori HASHIMOTO

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Chiyoda-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder layer and device bonding substrate using the same and method...
- Patent number 8,747,579
- Issue date Jun 10, 2014
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder layer, substrate for device joining utilizing the same and m...
- Patent number 8,516,692
- Issue date Aug 27, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER LAYER, SUBSTRATE FOR DEVICE JOINING UTILIZING THE SAME AND M...
- Publication number 20090095513
- Publication date Apr 16, 2009
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER LAYER AND DEVICE BONDING SUBSTRATE USING THE SAME AND METHOD...
- Publication number 20080205013
- Publication date Aug 28, 2008
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yoshikazu OSHIKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER LAYER AND ELECTRONIC DEVICE BONDING SUBSTRATE AND SUBMOUNT U...
- Publication number 20070228105
- Publication date Oct 4, 2007
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR