Muneo Kodaira

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Tsuchiura, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper foil for printed circuit board, method for fabricating same,...
- Patent number 7,344,785
- Issue date Mar 18, 2008
- Hitachi Cable, Ltd.
- Muneo Kodaira
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil for printed circuit board with taking environmental con...
- Patent number 7,108,923
- Issue date Sep 19, 2006
- Hitachi Cable, Ltd.
- Yasuyuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Copper foil for printed circuit board, method for fabricating same,...
- Publication number 20060257680
- Publication date Nov 16, 2006
- HITACHI CABLE, LTD.
- Muneo Kodaira
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR