Munjun KIM

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,211,795
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Jinsub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor device
- Patent number 11,882,691
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Seung-Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device using a thermally de...
- Patent number 11,791,209
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Seung-Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices
- Patent number 11,764,119
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Seungheon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,581,326
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Tae-Jong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device using a thermally de...
- Patent number 11,482,453
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Seung-Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor device
- Patent number 11,393,827
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Seung-Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices and manufacturing methods for the same
- Patent number 11,264,294
- Issue date Mar 1, 2022
- Samsung Electronics Co., Ltd.
- Seungheon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor device
- Patent number 10,748,908
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Seung-Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor device
- Patent number 10,566,333
- Issue date Feb 18, 2020
- Samsung Electronics Co., Ltd.
- Seung-Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITO...
- Publication number 20240234488
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Hyukwoo KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240172423
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Seung-Heon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITO...
- Publication number 20240136393
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyukwoo KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING A WIRING PROVIDED WITH A PROTECTIVE LAYER
- Publication number 20230067987
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Kyounghee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A THERMALLY DE...
- Publication number 20230043714
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Seung-Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220344276
- Publication date Oct 27, 2022
- Samsung Electronics Co., Ltd.
- JINSUB KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20220336468
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- Seung-Heon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES
- Publication number 20220173002
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- Seungheon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE
- Publication number 20210167080
- Publication date Jun 3, 2021
- Samsung Electronics Co., Ltd.
- TAE-JONG HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES AND MANUFACTURING METHODS FOR THE SAME
- Publication number 20210125884
- Publication date Apr 29, 2021
- Samsung Electronics Co., Ltd.
- Seungheon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A THERMALLY DE...
- Publication number 20200395244
- Publication date Dec 17, 2020
- Samsung Electronics Co., Ltd.
- Seung-Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20200357804
- Publication date Nov 12, 2020
- Samsung Electronics Co., Ltd.
- Seung-Heon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20190279988
- Publication date Sep 12, 2019
- Samsung Electronics Co., Ltd.
- Seung-Heon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20170005099
- Publication date Jan 5, 2017
- Samsung Electronics Co., Ltd.
- Seung-Heon LEE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device

Methods of fabricating semiconductor device

Method of manufacturing a semiconductor device using a thermally de...

Integrated circuit devices

Three-dimensional semiconductor memory device

Method of manufacturing a semiconductor device using a thermally de...

Methods of fabricating semiconductor device

Integrated circuit devices and manufacturing methods for the same

Methods of fabricating semiconductor device

Methods of fabricating semiconductor device

Patents Applicationslast 30 patents

CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITO...

METHODS OF FABRICATING SEMICONDUCTOR DEVICE

CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITO...

SEMICONDUCTOR DEVICES HAVING A WIRING PROVIDED WITH A PROTECTIVE LAYER

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A THERMALLY DE...

SEMICONDUCTOR DEVICE

METHODS OF FABRICATING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICES

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE

INTEGRATED CIRCUIT DEVICES AND MANUFACTURING METHODS FOR THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING A THERMALLY DE...

METHODS OF FABRICATING SEMICONDUCTOR DEVICE

METHODS OF FABRICATING SEMICONDUCTOR DEVICE

METHODS OF FABRICATING SEMICONDUCTOR DEVICE