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Murali SARANGAPANI

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Patents Grantslast 30 patents

  • Information Patent Grant

    Process for electrically connecting contact surfaces of electronic...
    • Patent number 11,791,309
    • Issue date Oct 17, 2023
    • HERAEUS MATERIALS SINGAPORE PTE. LTD.
    • Yean Mee Pun
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Coated wire
    • Patent number 11,236,430
    • Issue date Feb 1, 2022
    • HERAEUS MATERIALS SINGAPORE PTE. LTD.
    • Yee Weon Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coated wire
    • Patent number 10,960,498
    • Issue date Mar 30, 2021
    • Heraeus Materials Singapore Pte., Ltd.
    • Il Tae Kang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Alloyed 2N copper wires for bonding in microelectronics devices
    • Patent number 9,589,694
    • Issue date Mar 7, 2017
    • Heraeus Deutschland GmbH & Co. KG
    • Murali Sarangapani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Mold for encapsulating a semiconductor chip
    • Patent number 6,860,731
    • Issue date Mar 1, 2005
    • ASM Technology Singapore Pte. Ltd.
    • Shu Chuen Ho
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    COATED WIRE
    • Publication number 20240084472
    • Publication date Mar 14, 2024
    • Heraeus Materials Singapore Pte. Ltd.
    • Murali SARANGAPANI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    COATED WIRE
    • Publication number 20230374690
    • Publication date Nov 23, 2023
    • Heraeus Materials Singapore Pte. Ltd.
    • Miew Wan LO
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    PROCESS FOR ELECTRICALLY CONNECTING CONTACT SURFACES OF ELECTRONIC...
    • Publication number 20220037284
    • Publication date Feb 3, 2022
    • Heraeus Materials Singapore Pte. Ltd.
    • Yean M. Pun
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COATED WIRE
    • Publication number 20210222313
    • Publication date Jul 22, 2021
    • Heraeus Materials Singapore Pte. Ltd.
    • Yee Weon Lim
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    COATED WIRE
    • Publication number 20180345421
    • Publication date Dec 6, 2018
    • HERAEUS MATERIALS SINGAPORE PTE., LTD.
    • Il Tae Kang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
    • Publication number 20170154863
    • Publication date Jun 1, 2017
    • Heraeus Deutschland GmbH & Co. KG
    • Murali SARANGAPANI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    COPPER BOND WIRE AND METHOD OF MAKING THE SAME
    • Publication number 20160078980
    • Publication date Mar 17, 2016
    • HERAEUS MATERIALS SINGAPORE PTE., LTD.
    • Murali SARANGAPANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3N COPPER WIRES WITH TRACE ADDITIONS FOR BONDING IN MICROELECTRONIC...
    • Publication number 20130142568
    • Publication date Jun 6, 2013
    • HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
    • Murali SARANGAPANI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics D...
    • Publication number 20130140068
    • Publication date Jun 6, 2013
    • HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
    • Murali SARANGAPANI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    DOPED 4N COPPER WIRES FOR BONDING IN MICROELECTRONICS DEVICES
    • Publication number 20130142567
    • Publication date Jun 6, 2013
    • HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
    • Murali SARANGAPANI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Alloyed 2N Copper Wires for Bonding in Microelectronics Devices
    • Publication number 20130140084
    • Publication date Jun 6, 2013
    • HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
    • Murali SARANGAPANI
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Mold
    • Publication number 20030006529
    • Publication date Jan 9, 2003
    • ASM Technology Singapore Pte Ltd
    • Shu Chuen Ho
    • H01 - BASIC ELECTRIC ELEMENTS