Murugasan Manikam ACHARI

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method and structure of minimizing mold bleeding on a substrate sur...
- Patent number 8,546,936
- Issue date Oct 1, 2013
- Spansion LLC
- Pakhorudin Hussin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Carrier for stacked type semiconductor device and method of fabrica...
- Patent number 7,846,771
- Issue date Dec 7, 2010
- Spansion LLC
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure of minimizing mold bleeding on a substrate sur...
- Patent number 7,759,171
- Issue date Jul 20, 2010
- Spansion LLC
- Pakhorudin Hussin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for stacked type semiconductor device and method of fabrica...
- Patent number 7,414,305
- Issue date Aug 19, 2008
- Spansion LLC
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND STRUCTURE OF MINIMIZING MOLD BLEEDING ON A SUBSTRATE SUR...
- Publication number 20100258705
- Publication date Oct 14, 2010
- Pakhorudin HUSSIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CARRIER FOR STACKED TYPE SEMICONDUCTOR DEVICE AND METHOD OF FABRICA...
- Publication number 20080274591
- Publication date Nov 6, 2008
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier for stacked type semiconductor device and method of fabrica...
- Publication number 20060245908
- Publication date Nov 2, 2006
- Koji Taya
- H01 - BASIC ELECTRIC ELEMENTS