Mutsumi Watanabe

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Hitachinaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Packaging structure and method for automotive components
- Patent number 6,586,105
- Issue date Jul 1, 2003
- Hitachi, Ltd.
- Shuji Eguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Packaging structure and method for automotive components
- Publication number 20020031672
- Publication date Mar 14, 2002
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS