Mutsuyuki Kawaguchi

Person

Amagasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electroconductive layer, laminate using the same, and producing pro...
- Patent number 8,828,554
- Issue date Sep 9, 2014
- Mec Company Ltd.
- Mutsuyuki Kawaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a laminate
- Patent number 8,147,631
- Issue date Apr 3, 2012
- MEC Company Ltd.
- Mutsuyuki Kawaguchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding layer forming solution, method of producing copper-to-resin...
- Patent number 7,156,904
- Issue date Jan 2, 2007
- MEC Company Ltd.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonding layer for bonding resin on copper surface
- Patent number 7,029,761
- Issue date Apr 18, 2006
- MEC Company Ltd.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminate and method of manufacturing the same
- Patent number 6,733,886
- Issue date May 11, 2004
- MEC Company Ltd.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A LAMINATE
- Publication number 20100236690
- Publication date Sep 23, 2010
- MEC COMPANY LTD.
- Mutsuyuki KAWAGUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE LAYER FORMING LIQUID AND ADHESIVE LAYER FORMING PROCESS
- Publication number 20100108531
- Publication date May 6, 2010
- MEC COMPANY LTD.
- Mutsuyuki KAWAGUCHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADHESIVE LAYER FORMING LIQUID
- Publication number 20100000971
- Publication date Jan 7, 2010
- MEC COMPANY LTD.
- Mutsuyuki KAWAGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTROCONDUCTIVE LAYER, LAMINATE USING THE SAME, AND PRODUCING PRO...
- Publication number 20090197109
- Publication date Aug 6, 2009
- MEC COMPANY LTD.
- Mutsuyuki KAWAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming film of silane coupling agent
- Publication number 20080308964
- Publication date Dec 18, 2008
- MEC COMPANY LTD.
- Tsuyoshi Amatani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Adhesive layer for resin and a method of producing a laminate inclu...
- Publication number 20080261020
- Publication date Oct 23, 2008
- MEC COMPANY LTD.
- Mutsuyuki Kawaguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Bonding layer for bonding resin on copper surface
- Publication number 20040219375
- Publication date Nov 4, 2004
- MEC COMPANY LTD.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Bonding layer forming solution, method of producing copper-to-resin...
- Publication number 20040219377
- Publication date Nov 4, 2004
- MEC COMPANY LTD.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Laminate and method of manufacturing the same
- Publication number 20020192460
- Publication date Dec 19, 2002
- MEC COMPANY LTD.
- Mutsuyuki Kawaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Mutsuyuki Kawaguchi

Person

Patents Grantslast 30 patents

Electroconductive layer, laminate using the same, and producing pro...

Method for forming a laminate

Bonding layer forming solution, method of producing copper-to-resin...

Bonding layer for bonding resin on copper surface

Laminate and method of manufacturing the same

Patents Applicationslast 30 patents

METHOD FOR FORMING A LAMINATE

ADHESIVE LAYER FORMING LIQUID AND ADHESIVE LAYER FORMING PROCESS

ADHESIVE LAYER FORMING LIQUID

ELECTROCONDUCTIVE LAYER, LAMINATE USING THE SAME, AND PRODUCING PRO...

Method for forming film of silane coupling agent

Adhesive layer for resin and a method of producing a laminate inclu...

Bonding layer for bonding resin on copper surface

Bonding layer forming solution, method of producing copper-to-resin...

Laminate and method of manufacturing the same