My Nhu Nguyen

Person

Poway, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Compositions having a matrix and encapsulated phase change material...
- Patent number 10,481,653
- Issue date Nov 19, 2019
- Henkel IP & Holding GmbH
- My N. Nguyen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic devices assembled with heat absorbing and/or thermally i...
- Patent number 9,223,363
- Issue date Dec 29, 2015
- Henkel IP & Holding GmbH
- My N. Nguyen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic devices assembled with thermally insulating layers
- Patent number 9,209,105
- Issue date Dec 8, 2015
- Henkel IP & Holding GmbH
- My Nhu Nguyen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic devices assembled with thermally insulating layers
- Patent number 9,209,104
- Issue date Dec 8, 2015
- Henkel IP & Holding GmbH
- My Nhu Nguyen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adhesive compositions for use in die attach applications
- Patent number 8,835,574
- Issue date Sep 16, 2014
- Henkel IP Holding GmbH
- My Nguyen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Curable resin compositions useful as underfill sealants for use wit...
- Patent number 8,698,320
- Issue date Apr 15, 2014
- Henkel IP & Holding GmbH
- My Nhu Nguyen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermal interface material with epoxidized nutshell oil
- Patent number 8,648,460
- Issue date Feb 11, 2014
- Henkel US IP LLC
- My Nhu Nguyen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive compositions for use in die attach applications
- Patent number 8,338,536
- Issue date Dec 25, 2012
- Henkel Corporation
- My Nguyen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermal interface materials
- Patent number 7,867,609
- Issue date Jan 11, 2011
- Honeywell International Inc.
- My Nguyen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Interface materials and methods of production and use thereof
- Patent number 7,608,324
- Issue date Oct 27, 2009
- Honeywell International Inc.
- My N. Nguyen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal interface materials
- Patent number 7,244,491
- Issue date Jul 17, 2007
- Honeywell International, Inc.
- My N. Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Interface materials and methods of production and use thereof
- Patent number 7,172,711
- Issue date Feb 6, 2007
- Honeywell International, Inc.
- My N. Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface materials
- Patent number 6,908,669
- Issue date Jun 21, 2005
- Honeywell International Inc.
- My N. Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Compliant and crosslinkable thermal interface materials
- Patent number 6,811,725
- Issue date Nov 2, 2004
- Honeywell International Inc.
- My N. Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface materials
- Patent number 6,797,382
- Issue date Sep 28, 2004
- Honeywell International Inc.
- My Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Interface materials and methods of production and use thereof
- Patent number 6,706,219
- Issue date Mar 16, 2004
- Honeywell International Inc.
- My Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface materials
- Patent number 6,673,434
- Issue date Jan 6, 2004
- Honeywell International, Inc.
- My Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Compliant and crosslinkable thermal interface materials
- Patent number 6,605,238
- Issue date Aug 12, 2003
- Honeywell International Inc.
- My Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface materials
- Patent number 6,451,422
- Issue date Sep 17, 2002
- Johnson Matthey, Inc.
- My N. Nguyen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Compliant and crosslinkable thermal interface materials
- Patent number 6,238,596
- Issue date May 29, 2001
- Johnson Matthey Electronics, Inc.
- My N. Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin systems for organosilicon-containing compositions
- Patent number 6,117,930
- Issue date Sep 12, 2000
- Johnson Matthey, Inc.
- My N. Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Compliant and crosslinkable thermal interface materials
- Patent number 5,989,459
- Issue date Nov 23, 1999
- Johnson Matthey, Inc.
- My N. Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Organosilicon-containing compositions capable of rapid curing at lo...
- Patent number 5,859,105
- Issue date Jan 12, 1999
- Johnson Matthey, Inc.
- My N. Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Organosilicon-containing compositions having enhanced adhesive prop...
- Patent number 5,852,092
- Issue date Dec 22, 1998
- Johnson Matthey, Inc.
- My N. Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Die attach adhesive with reduced resin bleed
- Patent number 5,708,129
- Issue date Jan 13, 1998
- Johnson Matthey, Inc.
- My N. Nguyen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIAL...
- Publication number 20200042055
- Publication date Feb 6, 2020
- Henkel IP & Holding GmbH
- My N. Nguyen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMALLY INSULATING COMPOSITION AND ELECTRONIC DEVICES ASSEMBLED T...
- Publication number 20190198419
- Publication date Jun 27, 2019
- Henkel IP & Holding GmbH
- My N. Nguyen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPOSITIONS HAVING A MATRIX AND A HYDRATED SALT OF AN ACID AND A G...
- Publication number 20170322600
- Publication date Nov 9, 2017
- Henkel IP & Holding GmbH
- My Nhu Nguyen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIAL...
- Publication number 20170131751
- Publication date May 11, 2017
- Henkel IP & Holding GmbH
- My Nhu Nguyen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIAL...
- Publication number 20160334844
- Publication date Nov 17, 2016
- Henkel IP & Holding GmbH
- My N. Nguyen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMALLY INSULATIVE COMPOSITION AND ELECTRONIC DEVICES ASSEMBLED T...
- Publication number 20150155220
- Publication date Jun 4, 2015
- Henkel IP & Holding GmbH
- My N. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES ASSEMBLED WITH HEAT ABSORBING AND/OR THERMALLY I...
- Publication number 20140268579
- Publication date Sep 18, 2014
- Henkel Corporation
- My N. Nguyen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS
- Publication number 20140239480
- Publication date Aug 28, 2014
- Henkel lP & Holding GmbH
- My Nhu Nguyen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS
- Publication number 20140239481
- Publication date Aug 28, 2014
- Henkel IP & Holding GmbH
- My Nhu Nguyen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS
- Publication number 20140220337
- Publication date Aug 7, 2014
- HENKEL US IP LLC
- My Nguyen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS
- Publication number 20130079475
- Publication date Mar 28, 2013
- Henkel Corporation
- My Nguyen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMAL INTERFACE MATERIAL WITH PHENYL ESTER
- Publication number 20120279697
- Publication date Nov 8, 2012
- Deborah Forray
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermal Interface Material with Epoxidized Nutshell Oil
- Publication number 20120187556
- Publication date Jul 26, 2012
- My Nhu Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS FOR USE WIT...
- Publication number 20110133344
- Publication date Jun 9, 2011
- Henkel Corporation
- My Nhu Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS
- Publication number 20110070436
- Publication date Mar 24, 2011
- My Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BENZOXAZINE CONTAINING COMPOSITIONS OF MATTER AND CURABLE COMPOSITI...
- Publication number 20100140542
- Publication date Jun 10, 2010
- Henkel Corporation
- Qing Ji
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Interface materials and methods of production and use thereof
- Publication number 20080044670
- Publication date Feb 21, 2008
- My Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal interface materials
- Publication number 20070241307
- Publication date Oct 18, 2007
- My Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermal interconnect and interface systems, methods of production a...
- Publication number 20070164424
- Publication date Jul 19, 2007
- Nancy Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interface materials and methods of production and use thereof
- Publication number 20070098971
- Publication date May 3, 2007
- My N. Nguyen
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Application
Thermal interface materials
- Publication number 20060057364
- Publication date Mar 16, 2006
- My N. Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermal interconnect and interface systems, methods of production a...
- Publication number 20060040112
- Publication date Feb 23, 2006
- Nancy Dean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interface materials and methods of production and use thereof
- Publication number 20040185273
- Publication date Sep 23, 2004
- My N. Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal interface materials
- Publication number 20040137216
- Publication date Jul 15, 2004
- My N. Nguyen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Compliant and crosslinkable thermal interface materials
- Publication number 20040026670
- Publication date Feb 12, 2004
- My N. Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal interface materials
- Publication number 20030068487
- Publication date Apr 10, 2003
- My Nguyen
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermal interface materials
- Publication number 20020132896
- Publication date Sep 19, 2002
- My Nguyen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Compliant and crosslinkable thermal interface materials
- Publication number 20020007035
- Publication date Jan 17, 2002
- My Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interface materials and methods of production and use thereof
- Publication number 20010038093
- Publication date Nov 8, 2001
- Honeywell International Inc.
- My Nguyen
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

My Nhu Nguyen

Person

Patents Grantslast 30 patents

Compositions having a matrix and encapsulated phase change material...

Electronic devices assembled with heat absorbing and/or thermally i...

Electronic devices assembled with thermally insulating layers

Electronic devices assembled with thermally insulating layers

Adhesive compositions for use in die attach applications

Curable resin compositions useful as underfill sealants for use wit...

Thermal interface material with epoxidized nutshell oil

Adhesive compositions for use in die attach applications

Thermal interface materials

Interface materials and methods of production and use thereof

Thermal interface materials

Interface materials and methods of production and use thereof

Thermal interface materials

Compliant and crosslinkable thermal interface materials

Thermal interface materials

Interface materials and methods of production and use thereof

Thermal interface materials

Compliant and crosslinkable thermal interface materials

Thermal interface materials

Compliant and crosslinkable thermal interface materials

Resin systems for organosilicon-containing compositions

Compliant and crosslinkable thermal interface materials

Organosilicon-containing compositions capable of rapid curing at lo...

Organosilicon-containing compositions having enhanced adhesive prop...

Die attach adhesive with reduced resin bleed

Patents Applicationslast 30 patents

COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIAL...

THERMALLY INSULATING COMPOSITION AND ELECTRONIC DEVICES ASSEMBLED T...

COMPOSITIONS HAVING A MATRIX AND A HYDRATED SALT OF AN ACID AND A G...

COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIAL...

COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIAL...

THERMALLY INSULATIVE COMPOSITION AND ELECTRONIC DEVICES ASSEMBLED T...

ELECTRONIC DEVICES ASSEMBLED WITH HEAT ABSORBING AND/OR THERMALLY I...

ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS

ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS

ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS

ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS

THERMAL INTERFACE MATERIAL WITH PHENYL ESTER

Thermal Interface Material with Epoxidized Nutshell Oil

CURABLE RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS FOR USE WIT...

ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS

BENZOXAZINE CONTAINING COMPOSITIONS OF MATTER AND CURABLE COMPOSITI...

Interface materials and methods of production and use thereof

Thermal interface materials

Thermal interconnect and interface systems, methods of production a...

Interface materials and methods of production and use thereof

Thermal interface materials

Thermal interconnect and interface systems, methods of production a...

Interface materials and methods of production and use thereof

Thermal interface materials

Compliant and crosslinkable thermal interface materials

Thermal interface materials

Thermal interface materials

Compliant and crosslinkable thermal interface materials

Interface materials and methods of production and use thereof