Myeong Hui Jung

Person

Daejeon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate having electric component embedded therein
- Patent number 11,765,833
- Issue date Sep 19, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myeong Hui Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and antenna module comprising the same
- Patent number 11,432,396
- Issue date Aug 30, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myeong Hui Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and display module comprising the same
- Patent number 11,246,216
- Issue date Feb 8, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myeong Hui Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method for the same
- Patent number 11,166,365
- Issue date Nov 2, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- A-ran Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HAVING ELECTRIC COMPONENT EMBEDDED THEREIN
- Publication number 20230104939
- Publication date Apr 6, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Myeong Hui Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND DISPLAY MODULE COMPRISING THE SAME
- Publication number 20210282265
- Publication date Sep 9, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Myeong Hui Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ANTENNA MODULE COMPRISING THE SAME
- Publication number 20210274646
- Publication date Sep 2, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Myeong Hui JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200170102
- Publication date May 28, 2020
- Samsung Electro-Mechanics Co., Ltd.
- A-ran LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING T...
- Publication number 20130292164
- Publication date Nov 7, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jung Yong Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HAVING ELECTROMAGNETIC SHIELDING MEMBER
- Publication number 20100147563
- Publication date Jun 17, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Young Po Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Myeong Hui Jung

Person

Patents Grantslast 30 patents

Substrate having electric component embedded therein

Printed circuit board and antenna module comprising the same

Printed circuit board and display module comprising the same

Printed circuit board and manufacturing method for the same

Patents Applicationslast 30 patents

SUBSTRATE HAVING ELECTRIC COMPONENT EMBEDDED THEREIN

PRINTED CIRCUIT BOARD AND DISPLAY MODULE COMPRISING THE SAME

PRINTED CIRCUIT BOARD AND ANTENNA MODULE COMPRISING THE SAME

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING T...

SUBSTRATE HAVING ELECTROMAGNETIC SHIELDING MEMBER