MYOUNGCHUL EUM

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor device and method of separating...
- Patent number 12,354,879
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Cheonil Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250210448
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Myoungchul Eum
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP ATTACH FILM, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MET...
- Publication number 20250132280
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hansol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE ANTIOXIDANT LAYER
- Publication number 20240120266
- Publication date Apr 11, 2024
- SAMSUNG-RO, YEONGTONG-GU
- Sujung HYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096839
- Publication date Mar 21, 2024
- Samsung Electronics Co. Ltd.
- Seonho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF...
- Publication number 20240087940
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Cheonil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION AND WAFER PROCESSING TAPE INCLUDING THE SAME
- Publication number 20230212440
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- CHEONIL PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING GAS BLOWING AGENT
- Publication number 20230087718
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Cheonil PARK
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM...
- Publication number 20230086253
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Seonho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND METHOD OF SEPARATING...
- Publication number 20230040281
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Cheonil PARK
- B32 - LAYERED PRODUCTS

MYOUNGCHUL EUM

Person

Patents Grantslast 30 patents

Method of fabricating semiconductor device and method of separating...

Patents Applicationslast 30 patents

DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHIP ATTACH FILM, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MET...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE ANTIOXIDANT LAYER

SEMICONDUCTOR PACKAGE

WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF...

ADHESIVE COMPOSITION AND WAFER PROCESSING TAPE INCLUDING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING GAS BLOWING AGENT

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND METHOD OF SEPARATING...