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Myra MCDONNELL
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Portland, OR, US
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Patents Grants
last 30 patents
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Patent Grant
Stress compensation for wafer to wafer bonding
Patent number
11,721,554
Issue date
Aug 8, 2023
Intel Corporation
Anant Jahagirdar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structures having differentiated neighboring par...
Patent number
11,329,162
Issue date
May 10, 2022
Intel Corporation
Mauro J. Kobrinsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fluid viscosity control during wafer bonding
Patent number
11,056,356
Issue date
Jul 6, 2021
Intel Corporation
Brennen K. Mueller
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Patent Grant
Wafer to wafer bonding with low wafer distortion
Patent number
10,720,345
Issue date
Jul 21, 2020
Intel Corporation
Mauro J. Kobrinsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compliant layer for wafer to wafer bonding
Patent number
10,707,186
Issue date
Jul 7, 2020
Intel Corporation
Mauro J. Kobrinsky
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
STRESS COMPENSATION FOR WAFER TO WAFER BONDING
Publication number
20200303191
Publication date
Sep 24, 2020
Intel Corporation
Anant JAHAGIRDAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED NEIGHBORING PAR...
Publication number
20200075770
Publication date
Mar 5, 2020
Intel Corporation
Mauro J. KOBRINSKY
H01 - BASIC ELECTRIC ELEMENTS