Myron R. Cagan

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San Jose, CA, US

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Patents Grantslast 30 patents

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Method of manufacturing semiconductor device with reduced packaging...
- Patent number 5,171,716
- Issue date Dec 15, 1992
- North American Philips Corp.
- Myron R. Cagan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced packaging stress
- Patent number 5,045,918
- Issue date Sep 3, 1991
- North American Philips Corp.
- Myron R. Cagan
- H01 - BASIC ELECTRIC ELEMENTS