Myuki SUZUKI

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a through hole electrode substrate
- Patent number 8,637,397
- Issue date Jan 28, 2014
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A THROUGH HOLE ELECTRODE SUBSTRATE
- Publication number 20120329276
- Publication date Dec 27, 2012
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS