Myung Gun CHONG

Person

Gyeongsangnam-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board including electromagnetic bandgap structure
- Patent number 8,711,055
- Issue date Apr 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Won Woo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic laminate and manufacturing method of light emitting diode...
- Patent number 8,568,861
- Issue date Oct 29, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Myung Gun Chong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallic laminate and manufacturing method of light emitting diode...
- Patent number 8,481,171
- Issue date Jul 9, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Myung Gun Chong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing an embedded printed circuit board
- Patent number 8,418,356
- Issue date Apr 16, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic bandgap structure and printed circuit board having...
- Patent number 8,399,777
- Issue date Mar 19, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Won Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic bandgap structure and printed circuit board having...
- Patent number 8,330,048
- Issue date Dec 11, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Won Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 7,665,206
- Issue date Feb 23, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Kwang-Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE
- Publication number 20140191907
- Publication date Jul 10, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Won Woo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE P...
- Publication number 20130183479
- Publication date Jul 18, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Myung Gun CHONG
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed Circuit Board and Method Of Manufacturing The Same
- Publication number 20130139383
- Publication date Jun 6, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Kye Won Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ADN METHOD OF MANUFACTURING THE SAME
- Publication number 20110266038
- Publication date Nov 3, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kye Won CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light emitting device package and method for manufacturing the same
- Publication number 20110101406
- Publication date May 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Cheol Ho Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE
- Publication number 20100328178
- Publication date Dec 30, 2010
- Won Woo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20100319980
- Publication date Dec 23, 2010
- Hyung Ho KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE...
- Publication number 20100304162
- Publication date Dec 2, 2010
- Samsung Electro-Mechanics CO., LTD.
- Myung Gun CHONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING...
- Publication number 20100252319
- Publication date Oct 7, 2010
- Won Woo CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING...
- Publication number 20100252320
- Publication date Oct 7, 2010
- Won Woo CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded printed circuit board and manufacturing method thereof
- Publication number 20090242251
- Publication date Oct 1, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20080264687
- Publication date Oct 30, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Kwang-Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Myung Gun CHONG

Person

Patents Grantslast 30 patents

Printed circuit board including electromagnetic bandgap structure

Metallic laminate and manufacturing method of light emitting diode...

Metallic laminate and manufacturing method of light emitting diode...

Method of manufacturing an embedded printed circuit board

Electromagnetic bandgap structure and printed circuit board having...

Electromagnetic bandgap structure and printed circuit board having...

Printed circuit board and manufacturing method thereof

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE

METALIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE P...

Printed Circuit Board and Method Of Manufacturing The Same

PRINTED CIRCUIT BOARD ADN METHOD OF MANUFACTURING THE SAME

Light emitting device package and method for manufacturing the same

PRINTED CIRCUIT BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE

PRINTED CIRCUIT BOARD

METALLIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE...

ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING...

ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING...

Embedded printed circuit board and manufacturing method thereof

Printed circuit board and manufacturing method thereof