Myung Jin Yim

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with embedded optical die
- Patent number 12,078,853
- Issue date Sep 3, 2024
- Intel Corporation
- Vivek Raghunathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaging with silicon photonics hybrid planar lightwave circuit
- Patent number 11,982,854
- Issue date May 14, 2024
- Intel Corporation
- Sang Yup Kim
- G02 - OPTICS
Information Patent Grant
Co-packaging with silicon photonics hybrid planar lightwave circuit
- Patent number 11,531,174
- Issue date Dec 20, 2022
- Intel Corporation
- Sang Yup Kim
- G02 - OPTICS
Information Patent Grant
Semiconductor package with embedded optical die
- Patent number 11,156,788
- Issue date Oct 26, 2021
- Intel Corporation
- Vivek Raghunathan
- G02 - OPTICS
Information Patent Grant
Molding compound including a carbon nano-tube dispersion
- Patent number 10,953,593
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Myung Jin Yim
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Optoelectronic device module having a silicon interposer
- Patent number 10,727,368
- Issue date Jul 28, 2020
- Intel Corporation
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an optical module that includes an electronic...
- Patent number 10,347,615
- Issue date Jul 9, 2019
- Intel Corporation
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package photonics integration and assembly architecture
- Patent number 10,242,976
- Issue date Mar 26, 2019
- Intel Corporation
- Myung Jin Yim
- G02 - OPTICS
Information Patent Grant
Optoelectronic packaging assemblies
- Patent number 10,014,654
- Issue date Jul 3, 2018
- Intel Corporation
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a carbon nano-tube dispersion
- Patent number 9,950,464
- Issue date Apr 24, 2018
- Micron Technology, Inc.
- Myung Jin Yim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit with chip-on-chip and chip-on-substrate configur...
- Patent number 9,900,102
- Issue date Feb 20, 2018
- Intel Corporation
- Olufemi I. Dosunmu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dynamic beam steering optoelectronic packages
- Patent number 9,893,816
- Issue date Feb 13, 2018
- Intel Corporation
- Woosung Kim
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE
- Publication number 20240353631
- Publication date Oct 24, 2024
- Intel Corporation
- Vivek RAGHUNATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT
- Publication number 20240264396
- Publication date Aug 8, 2024
- Intel Corporation
- Sang Yup Kim
- G02 - OPTICS
Information Patent Application
CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT
- Publication number 20230091428
- Publication date Mar 23, 2023
- Intel Corporation
- Sang Yup Kim
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE
- Publication number 20210405306
- Publication date Dec 30, 2021
- Intel Corporation
- Vivek RAGHUNATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT
- Publication number 20200200987
- Publication date Jun 25, 2020
- Intel Corporation
- Sang Yup Kim
- G02 - OPTICS
Information Patent Application
PHOTONIC ENGINE PLATFORM UTILIZING EMBEDDED WAFER LEVEL PACKAGING I...
- Publication number 20190324223
- Publication date Oct 24, 2019
- Intel Corporation
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE
- Publication number 20190302379
- Publication date Oct 3, 2019
- Intel Corporation
- Vivek RAGHUNATHAN
- G02 - OPTICS
Information Patent Application
IN-PACKAGE PHOTONICS INTEGRATION AND ASSEMBLY ARCHITECTURE
- Publication number 20190172821
- Publication date Jun 6, 2019
- Intel Corporation
- Myung Jin Yim
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC DEVICE MODULE HAVING A SILICON INTERPOSER
- Publication number 20190006549
- Publication date Jan 3, 2019
- Intel Corporation
- Myung Jin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC DIE PACKAGE WITH EDGE LENS
- Publication number 20180348434
- Publication date Dec 6, 2018
- Intel Corporation
- Myung Jin Yim
- G02 - OPTICS
Information Patent Application
MOLDING COMPOUND INCLUDING A CARBON NANO-TUBE DISPERSION
- Publication number 20180229421
- Publication date Aug 16, 2018
- Micron Technology, Inc.
- Myung Jin Yim
- B82 - NANO-TECHNOLOGY
Information Patent Application
IN-PACKAGE PHOTONICS INTEGRATION AND ASSEMBLY ARCHITECTURE
- Publication number 20180188448
- Publication date Jul 5, 2018
- Intel Corporation
- Myung Jin Yim
- G02 - OPTICS
Information Patent Application
METHOD OF FABRICATING AN OPTICAL MODULE THAT INCLUDES AN ELECTRONIC...
- Publication number 20180047713
- Publication date Feb 15, 2018
- Intel Corporation
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON CHIP (COC) PACKAGE WITH INTERPOSER
- Publication number 20180041003
- Publication date Feb 8, 2018
- Intel Corporation
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC TRANSCEIVER ASSEMBLIES
- Publication number 20170288780
- Publication date Oct 5, 2017
- Intel Corporation
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC BEAM STEERING OPTOELECTRONIC PACKAGES
- Publication number 20170279537
- Publication date Sep 28, 2017
- Intel Corporation
- Woosung Kim
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT WITH CHIP-ON-CHIP AND CHIP-ON-SUBSTRATE CONFIGUR...
- Publication number 20170155450
- Publication date Jun 1, 2017
- Intel Corporation
- Olufemi I. Dosunmu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGING ASSEMBLIES
- Publication number 20170005453
- Publication date Jan 5, 2017
- Intel Corporation
- Myung Jin YIM
- H01 - BASIC ELECTRIC ELEMENTS

Myung Jin Yim

Person

Patents Grantslast 30 patents

Semiconductor package with embedded optical die

Co-packaging with silicon photonics hybrid planar lightwave circuit

Co-packaging with silicon photonics hybrid planar lightwave circuit

Semiconductor package with embedded optical die

Molding compound including a carbon nano-tube dispersion

Optoelectronic device module having a silicon interposer

Method of fabricating an optical module that includes an electronic...

In-package photonics integration and assembly architecture

Optoelectronic packaging assemblies

Forming a carbon nano-tube dispersion

Integrated circuit with chip-on-chip and chip-on-substrate configur...

Dynamic beam steering optoelectronic packages

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE

CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT

CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT

SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE

CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT

PHOTONIC ENGINE PLATFORM UTILIZING EMBEDDED WAFER LEVEL PACKAGING I...

SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE

IN-PACKAGE PHOTONICS INTEGRATION AND ASSEMBLY ARCHITECTURE

OPTOELECTRONIC DEVICE MODULE HAVING A SILICON INTERPOSER

PHOTONIC DIE PACKAGE WITH EDGE LENS

MOLDING COMPOUND INCLUDING A CARBON NANO-TUBE DISPERSION

IN-PACKAGE PHOTONICS INTEGRATION AND ASSEMBLY ARCHITECTURE

METHOD OF FABRICATING AN OPTICAL MODULE THAT INCLUDES AN ELECTRONIC...

CHIP ON CHIP (COC) PACKAGE WITH INTERPOSER

OPTOELECTRONIC TRANSCEIVER ASSEMBLIES

DYNAMIC BEAM STEERING OPTOELECTRONIC PACKAGES

INTEGRATED CIRCUIT WITH CHIP-ON-CHIP AND CHIP-ON-SUBSTRATE CONFIGUR...

OPTOELECTRONIC PACKAGING ASSEMBLIES