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Myung Jin Yim
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Co-packaging with silicon photonics hybrid planar lightwave circuit
Patent number
11,982,854
Issue date
May 14, 2024
Intel Corporation
Sang Yup Kim
G02 - OPTICS
Information
Patent Grant
Co-packaging with silicon photonics hybrid planar lightwave circuit
Patent number
11,531,174
Issue date
Dec 20, 2022
Intel Corporation
Sang Yup Kim
G02 - OPTICS
Information
Patent Grant
Semiconductor package with embedded optical die
Patent number
11,156,788
Issue date
Oct 26, 2021
Intel Corporation
Vivek Raghunathan
G02 - OPTICS
Information
Patent Grant
Molding compound including a carbon nano-tube dispersion
Patent number
10,953,593
Issue date
Mar 23, 2021
Micron Technology, Inc.
Myung Jin Yim
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Optoelectronic device module having a silicon interposer
Patent number
10,727,368
Issue date
Jul 28, 2020
Intel Corporation
Myung Jin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating an optical module that includes an electronic...
Patent number
10,347,615
Issue date
Jul 9, 2019
Intel Corporation
Myung Jin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
In-package photonics integration and assembly architecture
Patent number
10,242,976
Issue date
Mar 26, 2019
Intel Corporation
Myung Jin Yim
G02 - OPTICS
Information
Patent Grant
Optoelectronic packaging assemblies
Patent number
10,014,654
Issue date
Jul 3, 2018
Intel Corporation
Myung Jin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming a carbon nano-tube dispersion
Patent number
9,950,464
Issue date
Apr 24, 2018
Micron Technology, Inc.
Myung Jin Yim
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Integrated circuit with chip-on-chip and chip-on-substrate configur...
Patent number
9,900,102
Issue date
Feb 20, 2018
Intel Corporation
Olufemi I. Dosunmu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Dynamic beam steering optoelectronic packages
Patent number
9,893,816
Issue date
Feb 13, 2018
Intel Corporation
Woosung Kim
G02 - OPTICS
Patents Applications
last 30 patents
Information
Patent Application
CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT
Publication number
20230091428
Publication date
Mar 23, 2023
Intel Corporation
Sang Yup Kim
G02 - OPTICS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE
Publication number
20210405306
Publication date
Dec 30, 2021
Intel Corporation
Vivek RAGHUNATHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT
Publication number
20200200987
Publication date
Jun 25, 2020
Intel Corporation
Sang Yup Kim
G02 - OPTICS
Information
Patent Application
PHOTONIC ENGINE PLATFORM UTILIZING EMBEDDED WAFER LEVEL PACKAGING I...
Publication number
20190324223
Publication date
Oct 24, 2019
Intel Corporation
Myung Jin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE
Publication number
20190302379
Publication date
Oct 3, 2019
Intel Corporation
Vivek RAGHUNATHAN
G02 - OPTICS
Information
Patent Application
IN-PACKAGE PHOTONICS INTEGRATION AND ASSEMBLY ARCHITECTURE
Publication number
20190172821
Publication date
Jun 6, 2019
Intel Corporation
Myung Jin Yim
G02 - OPTICS
Information
Patent Application
OPTOELECTRONIC DEVICE MODULE HAVING A SILICON INTERPOSER
Publication number
20190006549
Publication date
Jan 3, 2019
Intel Corporation
Myung Jin YIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONIC DIE PACKAGE WITH EDGE LENS
Publication number
20180348434
Publication date
Dec 6, 2018
Intel Corporation
Myung Jin Yim
G02 - OPTICS
Information
Patent Application
MOLDING COMPOUND INCLUDING A CARBON NANO-TUBE DISPERSION
Publication number
20180229421
Publication date
Aug 16, 2018
Micron Technology, Inc.
Myung Jin Yim
B82 - NANO-TECHNOLOGY
Information
Patent Application
IN-PACKAGE PHOTONICS INTEGRATION AND ASSEMBLY ARCHITECTURE
Publication number
20180188448
Publication date
Jul 5, 2018
Intel Corporation
Myung Jin Yim
G02 - OPTICS
Information
Patent Application
METHOD OF FABRICATING AN OPTICAL MODULE THAT INCLUDES AN ELECTRONIC...
Publication number
20180047713
Publication date
Feb 15, 2018
Intel Corporation
Myung Jin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ON CHIP (COC) PACKAGE WITH INTERPOSER
Publication number
20180041003
Publication date
Feb 8, 2018
Intel Corporation
Juan E. Dominguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTOELECTRONIC TRANSCEIVER ASSEMBLIES
Publication number
20170288780
Publication date
Oct 5, 2017
Intel Corporation
Myung Jin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DYNAMIC BEAM STEERING OPTOELECTRONIC PACKAGES
Publication number
20170279537
Publication date
Sep 28, 2017
Intel Corporation
Woosung Kim
G02 - OPTICS
Information
Patent Application
INTEGRATED CIRCUIT WITH CHIP-ON-CHIP AND CHIP-ON-SUBSTRATE CONFIGUR...
Publication number
20170155450
Publication date
Jun 1, 2017
Intel Corporation
Olufemi I. Dosunmu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTOELECTRONIC PACKAGING ASSEMBLIES
Publication number
20170005453
Publication date
Jan 5, 2017
Intel Corporation
Myung Jin YIM
H01 - BASIC ELECTRIC ELEMENTS