MyungHo JUNG

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gyeonggi-do, KR

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Patents Applicationslast 30 patents

Information Patent Application
TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240421172
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND A PACKAGING METHOD
- Publication number 20240371812
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240363368
- Publication date Oct 31, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240105467
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME
- Publication number 20240096920
- Publication date Mar 21, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS