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Myungsam Kang

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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of fabricating a semiconductor package
    • Patent number 12,334,445
    • Issue date Jun 17, 2025
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,327,826
    • Issue date Jun 10, 2025
    • Samsung Electronics Co., Ltd.
    • Yongkoon Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor packages having wiring patterns
    • Patent number 12,278,191
    • Issue date Apr 15, 2025
    • Samsung Electronics Co., Ltd.
    • Youngchan Ko
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,261,105
    • Issue date Mar 25, 2025
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,183,665
    • Issue date Dec 31, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package and method of manufacturing the semiconductor...
    • Patent number 12,159,826
    • Issue date Dec 3, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,119,305
    • Issue date Oct 15, 2024
    • Samsung Electronics Co., Ltd.
    • Kyungdon Mun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,094,817
    • Issue date Sep 17, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package device
    • Patent number 12,062,632
    • Issue date Aug 13, 2024
    • Samsung Electronics Co., Ltd.
    • Kyung Don Mun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,057,380
    • Issue date Aug 6, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,046,562
    • Issue date Jul 23, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Methods of manufacturing semiconductor packages
    • Patent number 12,040,297
    • Issue date Jul 16, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,021,020
    • Issue date Jun 25, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out type semiconductor package and method of manufacturing the...
    • Patent number 12,002,798
    • Issue date Jun 4, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,935,847
    • Issue date Mar 19, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package with an antenna substrate
    • Patent number 11,935,849
    • Issue date Mar 19, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,916,002
    • Issue date Feb 27, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package module
    • Patent number 11,842,950
    • Issue date Dec 12, 2023
    • Samsung Electronics Co., Ltd.
    • Yongjin Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out semiconductor package
    • Patent number 11,837,537
    • Issue date Dec 5, 2023
    • Samsung Electronics Co., Ltd.
    • Bongju Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package including heat dissipation structure
    • Patent number 11,804,444
    • Issue date Oct 31, 2023
    • Samsung Electronics Co., Ltd.
    • Yongjin Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package and method of fabricating the same
    • Patent number 11,784,129
    • Issue date Oct 10, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out type semiconductor package
    • Patent number 11,721,620
    • Issue date Aug 8, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package device
    • Patent number 11,676,927
    • Issue date Jun 13, 2023
    • Samsung Electronics Co., Ltd.
    • Kyung Don Mun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,626,367
    • Issue date Apr 11, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package with under-bump metal structure
    • Patent number 11,581,284
    • Issue date Feb 14, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,569,175
    • Issue date Jan 31, 2023
    • Samsung Electronics Co., Ltd.
    • Kyungdon Mun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,569,158
    • Issue date Jan 31, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,562,966
    • Issue date Jan 24, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,538,737
    • Issue date Dec 27, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package with an antenna substrate
    • Patent number 11,527,495
    • Issue date Dec 13, 2022
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250118646
    • Publication date Apr 10, 2025
    • Samsung Electronics Co., Ltd.
    • MYUNGSAM KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250087637
    • Publication date Mar 13, 2025
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20250062221
    • Publication date Feb 20, 2025
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250046755
    • Publication date Feb 6, 2025
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACIAL MATERIAL PATTERNS
    • Publication number 20250029886
    • Publication date Jan 23, 2025
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250015065
    • Publication date Jan 9, 2025
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    • Publication number 20240429153
    • Publication date Dec 26, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE COMPRISING STIFFENER STRUCTURE
    • Publication number 20240413096
    • Publication date Dec 12, 2024
    • Samsung Electronics Co., Ltd.
    • OKGYEONG PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE DEVICE
    • Publication number 20240363573
    • Publication date Oct 31, 2024
    • Samsung Electronics Co., Ltd.
    • KYUNG DON MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240347468
    • Publication date Oct 17, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING GLASS CORE SUBSTRATE AND METHOD OF...
    • Publication number 20240321755
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240321728
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240162133
    • Publication date May 16, 2024
    • MYUNGSAM KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    • Publication number 20240030118
    • Publication date Jan 25, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240030145
    • Publication date Jan 25, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
    • Publication number 20240006325
    • Publication date Jan 4, 2024
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    • Publication number 20230411275
    • Publication date Dec 21, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE DEVICE
    • Publication number 20230275056
    • Publication date Aug 31, 2023
    • Samsung Electronics Co., Ltd.
    • KYUNG DON MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230230917
    • Publication date Jul 20, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE DEVICE
    • Publication number 20230197596
    • Publication date Jun 22, 2023
    • Samsung Electronics Co., Ltd.
    • Jeongseok KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES
    • Publication number 20230187399
    • Publication date Jun 15, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230178492
    • Publication date Jun 8, 2023
    • Samsung Electronics Co., Ltd.
    • Kyungdon MUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230154836
    • Publication date May 18, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230144454
    • Publication date May 11, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230148143
    • Publication date May 11, 2023
    • Samsung Electronics Co., Ltd.
    • Yongkoon LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES HAVING WIRING PATTERNS
    • Publication number 20230131240
    • Publication date Apr 27, 2023
    • Samsung Electronics Co., Ltd.
    • Youngchan KO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor package with an antenna substrate
    • Publication number 20230096506
    • Publication date Mar 30, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230075027
    • Publication date Mar 9, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
    • Publication number 20230038413
    • Publication date Feb 9, 2023
    • Samsung Electronics Co., Ltd.
    • Myungsam KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230016061
    • Publication date Jan 19, 2023
    • Samsung Electronics Co., Ltd.
    • Yongkoon LEE
    • H01 - BASIC ELECTRIC ELEMENTS