Myungsung Kang

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Yongin-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Die-to-wafer bonding structure and semiconductor package using the...
- Patent number 11,658,141
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-wafer bonding structure and semiconductor package using the...
- Patent number 11,289,438
- Issue date Mar 29, 2022
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230021376
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- Seonho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE...
- Publication number 20220181285
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE...
- Publication number 20210104482
- Publication date Apr 8, 2021
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS