Nachiket R. Raravikar

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Varied ball ball-grid-array (BGA) packages
- Patent number 11,916,003
- Issue date Feb 27, 2024
- Intel Corporation
- Xiao Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat spreader edge standoffs for managing bondline thickness in mic...
- Patent number 11,652,018
- Issue date May 16, 2023
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of utilizing low temperature solder assisted mounting techn...
- Patent number 11,417,592
- Issue date Aug 16, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packages and sinterable paste for use with thermal inter...
- Patent number 11,404,349
- Issue date Aug 2, 2022
- Intel Corporation
- Nachiket R. Raravikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader edge standoffs for managing bondline thickness in mic...
- Patent number 11,062,970
- Issue date Jul 13, 2021
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and materials for warpage thermal and interconnect solutions
- Patent number 10,672,626
- Issue date Jun 2, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,615,128
- Issue date Apr 7, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing a thermal soluti...
- Patent number 10,607,909
- Issue date Mar 31, 2020
- Intel Corporation
- Purushotham Kaushik Muthur Srinath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LPS solder paste based low cost fine pitch pop interconnect solutions
- Patent number 10,586,779
- Issue date Mar 10, 2020
- Intel Corporation
- Nachiket R. Raravikar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintered solder for fine pitch first-level interconnect (FLI) appli...
- Patent number 10,515,914
- Issue date Dec 24, 2019
- Intel Corporation
- Mihir A. Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 10,461,007
- Issue date Oct 29, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered solder for fine pitch first-level interconnect (FLI) appli...
- Patent number 10,224,299
- Issue date Mar 5, 2019
- Intel Corporation
- Mihir A. Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computing system with a thermal interface comprising magnetic parti...
- Patent number 10,181,432
- Issue date Jan 15, 2019
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shielding for system-in-package techno...
- Patent number 10,163,810
- Issue date Dec 25, 2018
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 9,953,929
- Issue date Apr 24, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space transformer with perforated metallic plate for electrical die...
- Patent number 9,941,652
- Issue date Apr 10, 2018
- Intel Corporation
- Nachiket R. Raravikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LPS solder paste based low cost fine pitch pop interconnect solutions
- Patent number 9,831,206
- Issue date Nov 28, 2017
- Intel Corporation
- Nachiket R. Raravikar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package design that facilitates shipping the electronic...
- Patent number 9,795,038
- Issue date Oct 17, 2017
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally and electrically conductive structure, method of applying...
- Patent number 9,669,425
- Issue date Jun 6, 2017
- Intel Corporation
- Linda Shekhawat
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and materials for warpage thermal and interconnect solutions
- Patent number 9,607,964
- Issue date Mar 28, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible underfill compositions for enhanced reliability
- Patent number 9,458,283
- Issue date Oct 4, 2016
- Intel Corporation
- Dingying Xu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Carbon nanotube-solder composite structures for interconnects, proc...
- Patent number 9,214,420
- Issue date Dec 15, 2015
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermally and electrically conductive structure comprising a carbon...
- Patent number 9,159,464
- Issue date Oct 13, 2015
- Intel Corporation
- Linda Shekhawat
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Flexible underfill compositions for enhanced reliability
- Patent number 9,068,067
- Issue date Jun 30, 2015
- Intel Corporation
- Dingying Xu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Integrated microelectronic package temperature sensor
- Patent number 9,028,142
- Issue date May 12, 2015
- Intel Corporation
- Nachiket R. Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Epoxy-amine underfill materials for semiconductor packages
- Patent number 8,916,981
- Issue date Dec 23, 2014
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanolithographic method of manufacturing an embedded passive device...
- Patent number 8,724,290
- Issue date May 13, 2014
- Intel Corporation
- Nachiket R. Raravikar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress sensor for in-situ measurement of package-induced stress in...
- Patent number 8,586,393
- Issue date Nov 19, 2013
- Intel Corporation
- Mohammad M. Farahani
- G01 - MEASURING TESTING
Information Patent Grant
Coating for a microelectronic device, treatment comprising same, an...
- Patent number 8,569,108
- Issue date Oct 29, 2013
- Intel Corporation
- Dingying Xu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of forming carbon nanotubes architectures and composites wi...
- Patent number 8,558,218
- Issue date Oct 15, 2013
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20240162134
- Publication date May 16, 2024
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...
- Publication number 20210305118
- Publication date Sep 30, 2021
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF UTILIZING LOW TEMPERATURE SOLDER ASSISTED MOUNTING TECHN...
- Publication number 20210287974
- Publication date Sep 16, 2021
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20210082798
- Publication date Mar 18, 2021
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP PACKAGES AND SINTERABLE PASTE FOR USE WITH THERMAL INTER...
- Publication number 20190267306
- Publication date Aug 29, 2019
- Intel Corporation
- Nachiket R. RARAVIKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...
- Publication number 20190157225
- Publication date May 23, 2019
- Intel Corporation
- Mihir A. OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME
- Publication number 20190099777
- Publication date Apr 4, 2019
- Intel Corporation
- Ken P. Hackenberg
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME
- Publication number 20190099776
- Publication date Apr 4, 2019
- Ken P. Hackenberg
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...
- Publication number 20190067153
- Publication date Feb 28, 2019
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A THERMAL SOLUTI...
- Publication number 20190043772
- Publication date Feb 7, 2019
- Intel Corporation
- Purushotham Kaushik MUTHUR SRINATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20180323128
- Publication date Nov 8, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE POLYMER THERMAL INTERFACE MATERIAL WITH SINTERED FILLERS F...
- Publication number 20180323130
- Publication date Nov 8, 2018
- Intel Corporation
- Boxi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING SYSTEM WITH A THERMAL INTERFACE COMPRISING MAGNETIC PARTI...
- Publication number 20180269128
- Publication date Sep 20, 2018
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20180226358
- Publication date Aug 9, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...
- Publication number 20180190604
- Publication date Jul 5, 2018
- Intel Corporation
- Mihir A. OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY STORAGE MATERIAL FOR THERMAL MANAGEMENT AND ASSOCIATED TECHN...
- Publication number 20180068926
- Publication date Mar 8, 2018
- Intel Corporation
- JAN KRAJNIAK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LPS SOLDER PASTE BASED LOW COST FINE PITCH POP INTERCONNECT SOLUTIONS
- Publication number 20180047693
- Publication date Feb 15, 2018
- Intel Corporation
- Nachiket R. RARAVIKAR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY COMPONENTS WITH CORNER ADHESIVE FOR WARPAGE RED...
- Publication number 20170287873
- Publication date Oct 5, 2017
- Santosh Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELOECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20170271270
- Publication date Sep 21, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD AND MATERIALS FOR WARPAGE THERMAL AND INTERCONNECT SOL...
- Publication number 20170200621
- Publication date Jul 13, 2017
- Intel Corporation
- Omkar G. KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic interference shielding for system-in-package techno...
- Publication number 20170186699
- Publication date Jun 29, 2017
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACE TRANSFORMER WITH PERFORATED METALLIC PLATE FOR ELECTRICAL DIE...
- Publication number 20170176518
- Publication date Jun 22, 2017
- Nachiket R. Raravikar
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE INTERPOSER HAVING ENCAPSULATED INTERCONNECTS
- Publication number 20170179080
- Publication date Jun 22, 2017
- Intel Corporation
- Akshay MATHKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACE TRANSFORMER INCLUDING A PERFORATED MOLD PREFORM FOR ELECTRICA...
- Publication number 20170176496
- Publication date Jun 22, 2017
- Akshay Mathkar
- G01 - MEASURING TESTING
Information Patent Application
ADHESIVE WITH TUNABLE ADHESION FOR HANDLING ULTRA-THIN WAFER
- Publication number 20170140971
- Publication date May 18, 2017
- NACHIKET R. RARAVIKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE DESIGN THAT FACILITATES SHIPPING THE ELECTRONIC...
- Publication number 20160095220
- Publication date Mar 31, 2016
- Intel Corporation
- Omkar Karhade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY AND ELECTRICALLY CONDUCTIVE STRUCTURE, METHOD OF APPLYING...
- Publication number 20150367378
- Publication date Dec 24, 2015
- Intel Corporation
- Linda Shekhawat
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY
- Publication number 20150284503
- Publication date Oct 8, 2015
- Intel Corporation
- Dingying XU
- C07 - ORGANIC CHEMISTRY
Information Patent Application
LPS SOLDER PASTE BASED LOW COST FINE PITCH POP INTERCONNECT SOLUTIONS
- Publication number 20150279804
- Publication date Oct 1, 2015
- Nachiket R. RARAVIKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD AND MATERIALS FOR WARPAGE THERMAL AND INTERCONNECT SOL...
- Publication number 20150279805
- Publication date Oct 1, 2015
- Omkar G. KARHADE
- H01 - BASIC ELECTRIC ELEMENTS

Nachiket R. Raravikar

Person

Patents Grantslast 30 patents

Varied ball ball-grid-array (BGA) packages

Heat spreader edge standoffs for managing bondline thickness in mic...

Methods of utilizing low temperature solder assisted mounting techn...

Multi-chip packages and sinterable paste for use with thermal inter...

Heat spreader edge standoffs for managing bondline thickness in mic...

Method and materials for warpage thermal and interconnect solutions

Systems and methods for electromagnetic interference shielding

Systems, methods, and apparatuses for implementing a thermal soluti...

LPS solder paste based low cost fine pitch pop interconnect solutions

Sintered solder for fine pitch first-level interconnect (FLI) appli...

Semiconductor package with electromagnetic interference shielding

Sintered solder for fine pitch first-level interconnect (FLI) appli...

Computing system with a thermal interface comprising magnetic parti...

Electromagnetic interference shielding for system-in-package techno...

Systems and methods for electromagnetic interference shielding

Space transformer with perforated metallic plate for electrical die...

LPS solder paste based low cost fine pitch pop interconnect solutions

Electronic package design that facilitates shipping the electronic...

Thermally and electrically conductive structure, method of applying...

Method and materials for warpage thermal and interconnect solutions

Flexible underfill compositions for enhanced reliability

Carbon nanotube-solder composite structures for interconnects, proc...

Thermally and electrically conductive structure comprising a carbon...

Flexible underfill compositions for enhanced reliability

Integrated microelectronic package temperature sensor

Epoxy-amine underfill materials for semiconductor packages

Nanolithographic method of manufacturing an embedded passive device...

Stress sensor for in-situ measurement of package-induced stress in...

Coating for a microelectronic device, treatment comprising same, an...

Methods of forming carbon nanotubes architectures and composites wi...

Patents Applicationslast 30 patents

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...

METHODS OF UTILIZING LOW TEMPERATURE SOLDER ASSISTED MOUNTING TECHN...

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

MULTI-CHIP PACKAGES AND SINTERABLE PASTE FOR USE WITH THERMAL INTER...

SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...

COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME

COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME

HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...

SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A THERMAL SOLUTI...

SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING

ADHESIVE POLYMER THERMAL INTERFACE MATERIAL WITH SINTERED FILLERS F...

COMPUTING SYSTEM WITH A THERMAL INTERFACE COMPRISING MAGNETIC PARTI...

SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...

ENERGY STORAGE MATERIAL FOR THERMAL MANAGEMENT AND ASSOCIATED TECHN...

LPS SOLDER PASTE BASED LOW COST FINE PITCH POP INTERCONNECT SOLUTIONS

ELECTRONIC ASSEMBLY COMPONENTS WITH CORNER ADHESIVE FOR WARPAGE RED...

SYSTEMS AND METHODS FOR ELOECTROMAGNETIC INTERFERENCE SHIELDING

NOVEL METHOD AND MATERIALS FOR WARPAGE THERMAL AND INTERCONNECT SOL...

Electromagnetic interference shielding for system-in-package techno...

SPACE TRANSFORMER WITH PERFORATED METALLIC PLATE FOR ELECTRICAL DIE...

SEMICONDUCTOR PACKAGE INTERPOSER HAVING ENCAPSULATED INTERCONNECTS

SPACE TRANSFORMER INCLUDING A PERFORATED MOLD PREFORM FOR ELECTRICA...

ADHESIVE WITH TUNABLE ADHESION FOR HANDLING ULTRA-THIN WAFER

ELECTRONIC PACKAGE DESIGN THAT FACILITATES SHIPPING THE ELECTRONIC...

THERMALLY AND ELECTRICALLY CONDUCTIVE STRUCTURE, METHOD OF APPLYING...

FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY

LPS SOLDER PASTE BASED LOW COST FINE PITCH POP INTERCONNECT SOLUTIONS

NOVEL METHOD AND MATERIALS FOR WARPAGE THERMAL AND INTERCONNECT SOL...