Nader NIKFAR

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San Diego, CA, US

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT
- Publication number 20240203820
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Youmin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THERMAL ENHANCEMENT STRUCTURES FOR MOLDED INTEGRATED CIRCU...
- Publication number 20190139852
- Publication date May 9, 2019
- QUALCOMM Incorporated
- Youmin YU
- H01 - BASIC ELECTRIC ELEMENTS