Nadia Ben-Mohamed

Person

Renage, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a substrate for a front-facing image sensor
- Patent number 12,100,727
- Issue date Sep 24, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for fracturing a plurality of wafer assemblies
- Patent number 12,002,690
- Issue date Jun 4, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting the splitting of a substrate weakened by impla...
- Patent number 12,002,697
- Issue date Jun 4, 2024
- Soitec
- François Rieutord
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a useful layer onto a support substrate
- Patent number 11,881,429
- Issue date Jan 23, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a useful layer to a carrier substrate
- Patent number 11,876,015
- Issue date Jan 16, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates including useful layers
- Patent number 11,670,540
- Issue date Jun 6, 2023
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable structure and removal method using the structure
- Patent number 11,424,156
- Issue date Aug 23, 2022
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for smoothing the surface of a semiconductor-on-insulator s...
- Patent number 11,276,605
- Issue date Mar 15, 2022
- Soitec
- Oleg Kononchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabrication of a semiconductor structure including an in...
- Patent number 11,114,314
- Issue date Sep 7, 2021
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a useful layer
- Patent number 10,950,491
- Issue date Mar 16, 2021
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a useful layer
- Patent number 9,922,867
- Issue date Mar 20, 2018
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a composite structure
- Patent number 9,887,124
- Issue date Feb 6, 2018
- Soitec
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a useful layer
- Patent number 9,589,830
- Issue date Mar 7, 2017
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of implantation for fragilization of substrates
- Patent number 9,425,081
- Issue date Aug 23, 2016
- SOITEC
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing irregularities at the surface of a layer transf...
- Patent number 8,946,053
- Issue date Feb 3, 2015
- Soitec
- Daniel Delprat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding two substrates
- Patent number 8,349,703
- Issue date Jan 8, 2013
- Soitec
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled temperature implantation
- Patent number 8,247,309
- Issue date Aug 21, 2012
- Soitec
- Sébastien Cattet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defectivity of post thin layer separation by modification of its se...
- Patent number 8,088,671
- Issue date Jan 3, 2012
- S.O.I. Tec Silicon on Insulator Technologies
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of splitting a substrate
- Patent number 8,003,493
- Issue date Aug 23, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for minimizing defects when transferring a semiconductor us...
- Patent number 7,749,862
- Issue date Jul 6, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finishing process for the manufacture of a semiconductor structure
- Patent number 7,514,341
- Issue date Apr 7, 2009
- S.O.I. Tec Silicon on Insulator Technologies
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of configuring a process to obtain a thin layer with a low d...
- Patent number 7,485,545
- Issue date Feb 3, 2009
- S.O.I. Tec Silicon on Insulator Technologies
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of detaching a layer from a wafer using a localized starting...
- Patent number 7,465,645
- Issue date Dec 16, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin layer transfer method utilizing co-implantation to reduce blis...
- Patent number 7,326,628
- Issue date Feb 5, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a high quality useful layer on a substrate uti...
- Patent number 7,081,399
- Issue date Jul 25, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR TRANSFERRING A USEFUL LAYER TO A FRONT FACE OF CARRIER S...
- Publication number 20240357937
- Publication date Oct 24, 2024
- SOITEC
- Cédric Charles-Alfred
Information Patent Application
SYSTEM FOR FRACTURING A PLURALITY OF WAFER ASSEMBLIES
- Publication number 20240222158
- Publication date Jul 4, 2024
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A THIN LAYER
- Publication number 20240030060
- Publication date Jan 25, 2024
- SOITEC
- Frédéric Mazen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR FRACTURING A PLURALITY OF WAFER ASSEMBLIES
- Publication number 20220181173
- Publication date Jun 9, 2022
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A USEFUL LAYER ONTO A SUPPORT SUBSTRATE
- Publication number 20220172983
- Publication date Jun 2, 2022
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A USE FUL LAYER TO A CARRIER SUBSTRATE
- Publication number 20220157650
- Publication date May 19, 2022
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A USEFUL LAYER ONTO A SUPPORT SUBSTRATE
- Publication number 20220157651
- Publication date May 19, 2022
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING DEVICE FOR AN ASSEMBLY THAT IS TO BE FRACTURED
- Publication number 20220059370
- Publication date Feb 24, 2022
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SUBSTRATE FOR A FRONT-FACING IMAGE SENSOR
- Publication number 20220059603
- Publication date Feb 24, 2022
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES INCLUDING USEFUL LAYERS
- Publication number 20210202302
- Publication date Jul 1, 2021
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE STRUCTURE AND REMOVAL METHOD USING THE STRUCTURE
- Publication number 20210050249
- Publication date Feb 18, 2021
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING THE SPLITTING OF A SUBSTRATE WEAKENED BY IMPLA...
- Publication number 20210028036
- Publication date Jan 28, 2021
- SOITEC
- François Rieutord
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATION OF A SEMICONDUCTOR STRUCTURE INCLUDING AN IN...
- Publication number 20200328094
- Publication date Oct 15, 2020
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR SMOOTHING THE SURFACE OF A SEMICONDUCTOR-ON-INSULATOR S...
- Publication number 20190348319
- Publication date Nov 14, 2019
- SOITEC
- Oleg Kononchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A USEFUL LAYER
- Publication number 20190221471
- Publication date Jul 18, 2019
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPOSITE STRUCTURE
- Publication number 20160372361
- Publication date Dec 22, 2016
- SOITEC
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A LAYER FROM A SINGLE-CRYSTAL SUBSTRATE
- Publication number 20160351438
- Publication date Dec 1, 2016
- SOITEC
- Ludovic Ecarnot
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR TRANSFERRING A USEFUL LAYER
- Publication number 20160233125
- Publication date Aug 11, 2016
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A USEFUL LAYER
- Publication number 20150303098
- Publication date Oct 22, 2015
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING SURFACE ROUGHNESS WHILE PRODUCING A HIGH QUALIT...
- Publication number 20150221545
- Publication date Aug 6, 2015
- SOITEC
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IMPLANTATION FOR FRAGILIZATION OF SUBSTRATES
- Publication number 20150050797
- Publication date Feb 19, 2015
- SOITEC
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON GLASS SUBSTRATE WITH STIFFENING LAYER AND PROCESS...
- Publication number 20130130473
- Publication date May 23, 2013
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING IRREGULARITIES AT THE SURFACE OF A LAYER TRANSF...
- Publication number 20130071997
- Publication date Mar 21, 2013
- SOITEC
- Daniel Delprat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON GLASS SUBSTRATE WITH STIFFENING LAYER AND PROCESS...
- Publication number 20120001293
- Publication date Jan 5, 2012
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED TEMPERATURE IMPLANTATION
- Publication number 20110312156
- Publication date Dec 22, 2011
- S. O. I. Tec Silicon on Insulator Technologies
- Sébastien Cattet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SPLITTING A SUBSTRATE
- Publication number 20100176493
- Publication date Jul 15, 2010
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFECTIVITY OF POST THIN LAYER SEPARATION BY MODIFICATION OF ITS SE...
- Publication number 20100105217
- Publication date Apr 29, 2010
- S. O. I. Tec Silicon on Insulator Technologies
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING TWO SUBSTRATES
- Publication number 20100093152
- Publication date Apr 15, 2010
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for simplification of a finishing sequence and structure ob...
- Publication number 20070148910
- Publication date Jun 28, 2007
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MINIMIZING DEFECTS WHEN TRANSFERRING A SEMICONDUCTOR US...
- Publication number 20070117229
- Publication date May 24, 2007
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS

Nadia Ben-Mohamed

Person

Patents Grantslast 30 patents

Method for manufacturing a substrate for a front-facing image sensor

System for fracturing a plurality of wafer assemblies

Method for detecting the splitting of a substrate weakened by impla...

Method for transferring a useful layer onto a support substrate

Method for transferring a useful layer to a carrier substrate

Substrates including useful layers

Removable structure and removal method using the structure

Process for smoothing the surface of a semiconductor-on-insulator s...

Method for fabrication of a semiconductor structure including an in...

Method for transferring a useful layer

Method for transferring a useful layer

Method for producing a composite structure

Method for transferring a useful layer

Method of implantation for fragilization of substrates

Method for reducing irregularities at the surface of a layer transf...

Method of bonding two substrates

Controlled temperature implantation

Defectivity of post thin layer separation by modification of its se...

Method of splitting a substrate

Methods for minimizing defects when transferring a semiconductor us...

Finishing process for the manufacture of a semiconductor structure

Method of configuring a process to obtain a thin layer with a low d...

Method of detaching a layer from a wafer using a localized starting...

Thin layer transfer method utilizing co-implantation to reduce blis...

Method for producing a high quality useful layer on a substrate uti...

Patents Applicationslast 30 patents

METHOD FOR TRANSFERRING A USEFUL LAYER TO A FRONT FACE OF CARRIER S...

SYSTEM FOR FRACTURING A PLURALITY OF WAFER ASSEMBLIES

METHOD FOR PREPARING A THIN LAYER

SYSTEM FOR FRACTURING A PLURALITY OF WAFER ASSEMBLIES

METHOD FOR TRANSFERRING A USEFUL LAYER ONTO A SUPPORT SUBSTRATE

METHOD FOR TRANSFERRING A USE FUL LAYER TO A CARRIER SUBSTRATE

METHOD FOR TRANSFERRING A USEFUL LAYER ONTO A SUPPORT SUBSTRATE

HOLDING DEVICE FOR AN ASSEMBLY THAT IS TO BE FRACTURED

METHOD FOR MANUFACTURING A SUBSTRATE FOR A FRONT-FACING IMAGE SENSOR

SUBSTRATES INCLUDING USEFUL LAYERS

REMOVABLE STRUCTURE AND REMOVAL METHOD USING THE STRUCTURE

METHOD FOR DETECTING THE SPLITTING OF A SUBSTRATE WEAKENED BY IMPLA...

METHOD FOR FABRICATION OF A SEMICONDUCTOR STRUCTURE INCLUDING AN IN...

PROCESS FOR SMOOTHING THE SURFACE OF A SEMICONDUCTOR-ON-INSULATOR S...

METHOD FOR TRANSFERRING A USEFUL LAYER

METHOD FOR PRODUCING A COMPOSITE STRUCTURE

METHOD FOR TRANSFERRING A LAYER FROM A SINGLE-CRYSTAL SUBSTRATE

METHOD FOR TRANSFERRING A USEFUL LAYER

METHOD FOR TRANSFERRING A USEFUL LAYER

METHOD FOR REDUCING SURFACE ROUGHNESS WHILE PRODUCING A HIGH QUALIT...

METHOD OF IMPLANTATION FOR FRAGILIZATION OF SUBSTRATES

SEMICONDUCTOR ON GLASS SUBSTRATE WITH STIFFENING LAYER AND PROCESS...

METHOD FOR REDUCING IRREGULARITIES AT THE SURFACE OF A LAYER TRANSF...

SEMICONDUCTOR ON GLASS SUBSTRATE WITH STIFFENING LAYER AND PROCESS...

CONTROLLED TEMPERATURE IMPLANTATION

METHOD OF SPLITTING A SUBSTRATE

DEFECTIVITY OF POST THIN LAYER SEPARATION BY MODIFICATION OF ITS SE...

METHOD OF BONDING TWO SUBSTRATES

Process for simplification of a finishing sequence and structure ob...

METHODS FOR MINIMIZING DEFECTS WHEN TRANSFERRING A SEMICONDUCTOR US...