Nae Hisano

Person

Matsudo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cell pack and container provided with same
- Patent number 10,522,799
- Issue date Dec 31, 2019
- Hitachi, Ltd.
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a liquid cooling module
- Patent number 8,937,390
- Issue date Jan 20, 2015
- PS4 Luxco S.A.R.L.
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a liquid cooling module
- Patent number 8,704,352
- Issue date Apr 22, 2014
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer of circuit board and joining structure of wafer or circuit board
- Patent number 8,334,465
- Issue date Dec 18, 2012
- Elpida Memory, Inc.
- Masakazu Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method of semiconductor and laminated structure fabricated...
- Patent number 7,618,847
- Issue date Nov 17, 2009
- Elpida Memory, Inc.
- Hiroyuki Tenmei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module in which a semiconductor package is bonded on...
- Patent number 7,573,128
- Issue date Aug 11, 2009
- Hitachi, Ltd.
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module
- Patent number 7,477,520
- Issue date Jan 13, 2009
- Elpida Memory, Inc.
- Masanori Shibamoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip, electrically connections therefor
- Patent number 7,432,594
- Issue date Oct 7, 2008
- Renesas Technology Corp.
- Kisho Ashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,119,428
- Issue date Oct 10, 2006
- Hitachi, Ltd.
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CELL PACK AND CONTAINER PROVIDED WITH SAME
- Publication number 20150214521
- Publication date Jul 30, 2015
- Hitachi, Ltd
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
- Publication number 20140183730
- Publication date Jul 3, 2014
- Nae HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD
- Publication number 20130140067
- Publication date Jun 6, 2013
- Elpida Memory, Inc.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
- Publication number 20100171213
- Publication date Jul 8, 2010
- Elpida Memory, Inc.
- Nae HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20090134498
- Publication date May 28, 2009
- Elpida Memory, Inc.
- Hiroaki IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer of circuit board and joining structure of wafer or circuit board
- Publication number 20090109641
- Publication date Apr 30, 2009
- Elpida Memory, Inc.
- Masakazu Ishino
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED...
- Publication number 20090072414
- Publication date Mar 19, 2009
- Hiroyuki TENMEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory module
- Publication number 20060244126
- Publication date Nov 2, 2006
- ELPIDA MEMORY, INC.
- Masanori Shibamoto
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor device
- Publication number 20060043618
- Publication date Mar 2, 2006
- Renesas Technology Corp.
- Kisho Ashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050189639
- Publication date Sep 1, 2005
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module
- Publication number 20050001302
- Publication date Jan 6, 2005
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Cell pack and container provided with same

Semiconductor device having a liquid cooling module

Semiconductor device having a liquid cooling module

Wafer of circuit board and joining structure of wafer or circuit board

Bonding method of semiconductor and laminated structure fabricated...

Semiconductor module in which a semiconductor package is bonded on...

Memory module

Semiconductor chip, electrically connections therefor

Semiconductor device

Patents Applicationslast 30 patents

CELL PACK AND CONTAINER PROVIDED WITH SAME

SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE

WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD

SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE

SEMICONDUCTOR APPARATUS

Wafer of circuit board and joining structure of wafer or circuit board

BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED...

Memory module

Semiconductor device

Semiconductor device

Semiconductor module