Nafees A. Kabir

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 12,087,836
- Issue date Sep 10, 2024
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,887,887
- Issue date Jan 30, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 11,837,644
- Issue date Dec 5, 2023
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,784,123
- Issue date Oct 10, 2023
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Helmet structures for semiconductor interconnects
- Patent number 11,646,266
- Issue date May 9, 2023
- Intel Corporation
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maskless air gap enabled by a single damascene process
- Patent number 11,610,810
- Issue date Mar 21, 2023
- Intel Corporation
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two terminal spin orbit memory devices and methods of fabrication
- Patent number 11,594,673
- Issue date Feb 28, 2023
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single mask lithography line end enhancement
- Patent number 11,462,469
- Issue date Oct 4, 2022
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 11,444,024
- Issue date Sep 13, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned local interconnects
- Patent number 11,424,160
- Issue date Aug 23, 2022
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication
- Patent number 11,404,307
- Issue date Aug 2, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned repeatedly stackable 3D vertical RRAM
- Patent number 11,404,482
- Issue date Aug 2, 2022
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor structures with asymmetrical terminal interconnects
- Patent number 11,342,227
- Issue date May 24, 2022
- Intel Corporation
- Aaron Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,289,421
- Issue date Mar 29, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar slab vias for integrated circuit interconnects
- Patent number 11,239,156
- Issue date Feb 1, 2022
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with airgaps to control capacitance
- Patent number 10,665,499
- Issue date May 26, 2020
- Intel Corporation
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAY...
- Publication number 20240203868
- Publication date Jun 20, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PATTERNING OF PLATE LINES IN THREE-DIMENSIONAL FERROEL...
- Publication number 20240114693
- Publication date Apr 4, 2024
- Intel Corporation
- Christopher M. Neumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH MULTILAYER METAL LINE
- Publication number 20240105588
- Publication date Mar 28, 2024
- Intel Corporation
- Ilya V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...
- Publication number 20240047543
- Publication date Feb 8, 2024
- Intel Corporation
- Rami HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CONTA...
- Publication number 20230307514
- Publication date Sep 28, 2023
- Intel Corporation
- Joseph D'SILVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SPACERS WITH HARD MASKS FORMED USING A SUBTRACTIVE PROCESS
- Publication number 20230230919
- Publication date Jul 20, 2023
- Intel Corporation
- Nafees A. Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING
- Publication number 20230187395
- Publication date Jun 15, 2023
- Intel Corporation
- Nafees A. KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED ETCH TO ENABLE TIN REMOVAL FROM SELECTED SIDEWALLS
- Publication number 20230102900
- Publication date Mar 30, 2023
- Intel Corporation
- Nafees A. KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC RANDOM ACCESS MEMORY (FRAM) DEVICES WITH ENHANCED CAP...
- Publication number 20230097736
- Publication date Mar 30, 2023
- Intel Corporation
- Shriram SHIVARAMAN
- G11 - INFORMATION STORAGE
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220352068
- Publication date Nov 3, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20220336267
- Publication date Oct 20, 2022
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR SLAB VIAS FOR INTEGRATED CIRCUIT INTERCONNECTS
- Publication number 20220223518
- Publication date Jul 14, 2022
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...
- Publication number 20220181251
- Publication date Jun 9, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220139823
- Publication date May 5, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION STACKS WITH SELF-ALIGNED STAGGERED METAL LINES
- Publication number 20220084942
- Publication date Mar 17, 2022
- Intel Corporation
- Elijah V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR STRUCTURES WITH ASYMMETRICAL TERMINAL INTERCONNECTS
- Publication number 20210305098
- Publication date Sep 30, 2021
- Intel Corporation
- Aaron Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR SLAB VIAS FOR INTEGRATED CIRCUIT INTERCONNECTS
- Publication number 20210296231
- Publication date Sep 23, 2021
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...
- Publication number 20210098359
- Publication date Apr 1, 2021
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NTERCONNECT STRUCTURES AND METHODS OF FABRICATION
- Publication number 20210098360
- Publication date Apr 1, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...
- Publication number 20210091194
- Publication date Mar 25, 2021
- Intel Corporation
- Rami HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELMET STRUCTURES FOR SEMICONDUCTOR INTERCONNECTS
- Publication number 20210043565
- Publication date Feb 11, 2021
- Intel Corporation
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20200402917
- Publication date Dec 24, 2020
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO TERMINAL SPIN ORBIT MEMORY DEVICES AND METHODS OF FABRICATION
- Publication number 20200313075
- Publication date Oct 1, 2020
- Intel Corporation
- Noriyuki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED LOCAL INTERCONNECTS
- Publication number 20200258778
- Publication date Aug 13, 2020
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS AIR GAP ENABLED BY A SINGLE DAMASCENE PROCESS
- Publication number 20200203212
- Publication date Jun 25, 2020
- Intel Corporation
- Miriam R. RESHOTKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE MASK LITHOGRAPHY LINE END ENHANCEMENT
- Publication number 20200105662
- Publication date Apr 2, 2020
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED REPEATEDLY STACKABLE 3D VERTICAL RRAM
- Publication number 20200006427
- Publication date Jan 2, 2020
- Intel Corporation
- Noriyuki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with Airgaps to Control Capacitance
- Publication number 20200006115
- Publication date Jan 2, 2020
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS

Nafees A. Kabir

Person

Patents Grantslast 30 patents

Contact over active gate structures with metal oxide-caped contacts...

Subtractively patterned interconnect structures for integrated circ...

Interconnect structures and methods of fabrication

Contact over active gate structures with metal oxide-caped contacts...

Methods and structures for improved electrical contact between bond...

Helmet structures for semiconductor interconnects

Maskless air gap enabled by a single damascene process

Two terminal spin orbit memory devices and methods of fabrication

Single mask lithography line end enhancement

Subtractively patterned interconnect structures for integrated circ...

Self-aligned local interconnects

Interconnect structures and methods of fabrication

Self-aligned repeatedly stackable 3D vertical RRAM

Stacked transistor structures with asymmetrical terminal interconnects

Methods and structures for improved electrical contact between bond...

Planar slab vias for integrated circuit interconnects

Integrated circuit with airgaps to control capacitance

Patents Applicationslast 30 patents

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAY...

SELF-ALIGNED PATTERNING OF PLATE LINES IN THREE-DIMENSIONAL FERROEL...

INTEGRATED CIRCUIT (IC) DEVICE WITH MULTILAYER METAL LINE

CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CONTA...

METAL SPACERS WITH HARD MASKS FORMED USING A SUBTRACTIVE PROCESS

OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING

ANGLED ETCH TO ENABLE TIN REMOVAL FROM SELECTED SIDEWALLS

FERROELECTRIC RANDOM ACCESS MEMORY (FRAM) DEVICES WITH ENHANCED CAP...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION

PLANAR SLAB VIAS FOR INTEGRATED CIRCUIT INTERCONNECTS

METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

METALLIZATION STACKS WITH SELF-ALIGNED STAGGERED METAL LINES

STACKED TRANSISTOR STRUCTURES WITH ASYMMETRICAL TERMINAL INTERCONNECTS

PLANAR SLAB VIAS FOR INTEGRATED CIRCUIT INTERCONNECTS

METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...

NTERCONNECT STRUCTURES AND METHODS OF FABRICATION

CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...

HELMET STRUCTURES FOR SEMICONDUCTOR INTERCONNECTS

INTEGRATED CIRCUIT STRUCTURE

TWO TERMINAL SPIN ORBIT MEMORY DEVICES AND METHODS OF FABRICATION

SELF-ALIGNED LOCAL INTERCONNECTS

MASKLESS AIR GAP ENABLED BY A SINGLE DAMASCENE PROCESS

SINGLE MASK LITHOGRAPHY LINE END ENHANCEMENT

SELF-ALIGNED REPEATEDLY STACKABLE 3D VERTICAL RRAM

Integrated Circuit with Airgaps to Control Capacitance