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Nagarajan JAYARAJU

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  • Framingham, MA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of filling through-holes to reduce voids and other defects
    • Patent number 10,508,357
    • Issue date Dec 17, 2019
    • Rohm and Haas Electronic Materials LLC
    • Nagarajan Jayaraju
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Method of filling through-holes to reduce voids and other defects
    • Patent number 10,512,174
    • Issue date Dec 17, 2019
    • Rohm and Haas Electronic Materials LLC
    • Nagarajan Jayaraju
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Filling through-holes
    • Patent number 10,154,598
    • Issue date Dec 11, 2018
    • Rohm and Haas Electronic Materials LLC
    • Nagarajan Jayaraju
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Method of filling through-holes
    • Patent number 9,598,787
    • Issue date Mar 21, 2017
    • Rohm and Haas Electronic Materials LLC
    • Nagarajan Jayaraju
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS
    • Publication number 20230279577
    • Publication date Sep 7, 2023
    • Rohm and Haas Electronic Materials L.L.C.
    • Nagarajan Jayaraju
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS
    • Publication number 20170238427
    • Publication date Aug 17, 2017
    • Rohm and Haas Electronic Materials L.L.C.
    • Nagarajan Jayaraju
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS
    • Publication number 20170233886
    • Publication date Aug 17, 2017
    • Rohm and Haas Electronic Materials L.L.C.
    • Nagarajan Jayaraju
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    FILLING THROUGH-HOLES
    • Publication number 20160105975
    • Publication date Apr 14, 2016
    • Rohm and Haas Electronic Materials L.L.C.
    • Nagarajan JAYARAJU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF FILLING THROUGH-HOLES
    • Publication number 20140262801
    • Publication date Sep 18, 2014
    • Nagarajan JAYARAJU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF FILLING THROUGH-HOLES
    • Publication number 20140262799
    • Publication date Sep 18, 2014
    • Rohm and Haas Electronic Materials L.L.C.
    • Nagarajan JAYARAJU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR