Nagatoshi Tsunoda

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Tsukuba, JP

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Patents Grantslast 30 patents

Information Patent Grant
Singulation of microelectronic components with direct bonding inter...
- Patent number 12,119,317
- Issue date Oct 15, 2024
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...
- Publication number 20250015028
- Publication date Jan 9, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMP...
- Publication number 20240063071
- Publication date Feb 22, 2024
- Intel Corporation
- Jeffery Bielefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES
- Publication number 20240063142
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...
- Publication number 20220102305
- Publication date Mar 31, 2022
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS