Nai Hua Yeh

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a package structure of integrated circuits
- Patent number 6,642,137
- Issue date Nov 4, 2003
- Kingpak Technology Inc.
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module structure
- Patent number 6,642,554
- Issue date Nov 4, 2003
- Kingpak Technology, Inc.
- Nai Hua Yeh
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked package structure of image sensor
- Patent number 6,627,983
- Issue date Sep 30, 2003
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module card and a method for manufacturing the same
- Patent number 6,565,008
- Issue date May 20, 2003
- Kingpak Technology Inc.
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure of image sensor
- Patent number 6,559,539
- Issue date May 6, 2003
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having central leads and method for...
- Patent number 6,501,187
- Issue date Dec 31, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure for memory chips
- Patent number 6,472,736
- Issue date Oct 29, 2002
- Kingpak Technology Inc.
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure of semiconductor means and method for manufacturi...
- Patent number 6,400,007
- Issue date Jun 4, 2002
- Kingpak Technology Inc.
- Jichen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating isolating regions for buried conductors
- Patent number 5,830,772
- Issue date Nov 3, 1998
- United MicroelectronicsCorp.
- Che-Pin Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Image sensor structure
- Publication number 20030116817
- Publication date Jun 26, 2003
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked structure of a ball grid array (BGA) integrated circuit pac...
- Publication number 20030116846
- Publication date Jun 26, 2003
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory module structure
- Publication number 20030094628
- Publication date May 22, 2003
- Nai Hua Yeh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MODULE CARD AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20030071129
- Publication date Apr 17, 2003
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor package structure having films and method for...
- Publication number 20020151102
- Publication date Oct 17, 2002
- Jichen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a package structure of integrated circuits
- Publication number 20020130391
- Publication date Sep 19, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked structure of integrated circuits
- Publication number 20020096754
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of stacked integrated circuits and method for manufacturi...
- Publication number 20020096762
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of integrated circuits and method for packaging t...
- Publication number 20020096766
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096729
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096730
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit structure having an adhesive agent and method fo...
- Publication number 20020096751
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of an integrated circuit
- Publication number 20020096747
- Publication date Jul 25, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...
- Publication number 20020096761
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package structure of image sensor
- Publication number 20020096753
- Publication date Jul 25, 2002
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable integrated circuit
- Publication number 20020043709
- Publication date Apr 18, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Nai Hua Yeh

Person

Patents Grantslast 30 patents

Method for manufacturing a package structure of integrated circuits

Memory module structure

Stacked package structure of image sensor

Module card and a method for manufacturing the same

Stacked package structure of image sensor

Semiconductor package structure having central leads and method for...

Stacked structure for memory chips

Stacked structure of semiconductor means and method for manufacturi...

Method for fabricating isolating regions for buried conductors

Patents Applicationslast 30 patents

Image sensor structure

Stacked structure of a ball grid array (BGA) integrated circuit pac...

Memory module structure

MODULE CARD AND A METHOD FOR MANUFACTURING THE SAME

Stacked semiconductor package structure having films and method for...

Method for manufacturing a package structure of integrated circuits

Stacked structure of integrated circuits

Structure of stacked integrated circuits and method for manufacturi...

Package structure of integrated circuits and method for packaging t...

Stacked package structure of image sensor

Stacked package structure of image sensor

Integrated circuit structure having an adhesive agent and method fo...

Package structure of an integrated circuit

STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...

Stacked package structure of image sensor

Stackable integrated circuit