Nai Huai Liu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having an interposer in which one or more die...
- Patent number 12,136,597
- Issue date Nov 5, 2024
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,948,895
- Issue date Apr 2, 2024
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structure and method of forming the same
- Patent number 11,854,784
- Issue date Dec 26, 2023
- Mediatek Inc.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure including antenna
- Patent number 11,824,020
- Issue date Nov 21, 2023
- Mediatek Inc.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structure and method of forming the same
- Patent number 11,791,266
- Issue date Oct 17, 2023
- Mediatek Inc.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure with integrated antenna
- Patent number 11,742,564
- Issue date Aug 29, 2023
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly having a conductive electromagnetic...
- Patent number 11,728,292
- Issue date Aug 15, 2023
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including lid structure with opening and recess
- Patent number 11,688,655
- Issue date Jun 27, 2023
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Innovative air gap for antenna fan out package
- Patent number 11,652,273
- Issue date May 16, 2023
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with antenna
- Patent number 11,574,881
- Issue date Feb 7, 2023
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package and methods of forming thereof
- Patent number 11,532,577
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure including antenna
- Patent number 11,508,678
- Issue date Nov 22, 2022
- Mediatek Inc.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package structure and method of forming the same
- Patent number 11,450,606
- Issue date Sep 20, 2022
- Mediatek Inc.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,410,936
- Issue date Aug 9, 2022
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with antenna
- Patent number 11,081,453
- Issue date Aug 3, 2021
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure with integrated antenna
- Patent number 11,043,730
- Issue date Jun 22, 2021
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with antenna and fabrication method thereof
- Patent number 11,024,954
- Issue date Jun 1, 2021
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including lid structure with opening and recess
- Patent number 10,957,611
- Issue date Mar 23, 2021
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PoP device
- Patent number 10,867,897
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,784,211
- Issue date Sep 22, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package and methods of forming thereof
- Patent number 10,741,511
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked fan-out package structure
- Patent number 10,692,789
- Issue date Jun 23, 2020
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 10,522,439
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method for forming the same
- Patent number 10,483,211
- Issue date Nov 19, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly
- Patent number 10,468,341
- Issue date Nov 5, 2019
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package and methods of forming thereof
- Patent number 10,366,960
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Company
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved bandwidth
- Patent number 10,217,723
- Issue date Feb 26, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly
- Patent number 10,199,318
- Issue date Feb 5, 2019
- Mediatek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out POP structure with inconsecutive polymer layer
- Patent number 10,083,913
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and manufacturing method thereof
- Patent number 9,978,657
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA PACKAGE
- Publication number 20250038412
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Nai-Chen LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Band Antenna
- Publication number 20250015498
- Publication date Jan 9, 2025
- MEDIATEK INC.
- Nai-Chen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240297120
- Publication date Sep 5, 2024
- MEDIATEK INC.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240290737
- Publication date Aug 29, 2024
- MEDIATEK INC.
- Hung-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, METHOD OF FORMING THE SAME AND SEM...
- Publication number 20240274517
- Publication date Aug 15, 2024
- MEDIATEK INC.
- Fa-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240178112
- Publication date May 30, 2024
- MEDIATEK INC.
- Yu-Tung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240153887
- Publication date May 9, 2024
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE
- Publication number 20240079767
- Publication date Mar 7, 2024
- MEDIATEK INC.
- Yen-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA AND ELECTRONIC DEVICE INCLUDING THE ANTENNA
- Publication number 20240072426
- Publication date Feb 29, 2024
- MEDIATEK INC.
- Nai-Chen LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20240047886
- Publication date Feb 8, 2024
- MEDIATEK INC.
- Nai-Chen LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA
- Publication number 20240039165
- Publication date Feb 1, 2024
- MEDIATEK INC.
- Hsuan-Jui CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240038614
- Publication date Feb 1, 2024
- MEDIATEK INC.
- Yi-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387075
- Publication date Nov 30, 2023
- MEDIATEK INC.
- Yi-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA
- Publication number 20230268656
- Publication date Aug 24, 2023
- MEDIATEK INC.
- Chung-Hsin CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230073399
- Publication date Mar 9, 2023
- MEDIATEK INC.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING ANTENNA
- Publication number 20230056550
- Publication date Feb 23, 2023
- MEDIATEK INC.
- Yen-Yao CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220392839
- Publication date Dec 8, 2022
- MEDIATEK INC.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220336374
- Publication date Oct 20, 2022
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNOVATIVE AIR GAP FOR ANTENNA FAN OUT PACKAGE
- Publication number 20220173497
- Publication date Jun 2, 2022
- Media Tek Inc.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20220157732
- Publication date May 19, 2022
- MEDIATEK INC.
- Yi-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH ANTENNA
- Publication number 20210327835
- Publication date Oct 21, 2021
- MEDIATEK INC.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE WITH INTEGRATED ANTENNA
- Publication number 20210273317
- Publication date Sep 2, 2021
- MEDIATEK INC.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING LID STRUCTURE WITH OPENING AND RECESS
- Publication number 20210175137
- Publication date Jun 10, 2021
- MEDIATEK INC.
- Chia-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING ANTENNA
- Publication number 20210035930
- Publication date Feb 4, 2021
- MEDIATEK INC.
- Yen-Yao CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package and Methods of Forming Thereof
- Publication number 20200373264
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200365526
- Publication date Nov 19, 2020
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200312732
- Publication date Oct 1, 2020
- MEDIATEK INC.
- Yen-Yao CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY HAVING A CONDUCTIVE ELECTROMAGNETIC...
- Publication number 20200168572
- Publication date May 28, 2020
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200091070
- Publication date Mar 19, 2020
- MEDIATEK INC.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH ANTENNA
- Publication number 20200013735
- Publication date Jan 9, 2020
- MEDIATEK INC.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS

Nai Huai Liu

Person

Patents Grantslast 30 patents

Semiconductor package having an interposer in which one or more die...

Semiconductor package structure

Chip scale package structure and method of forming the same

Semiconductor package structure including antenna

Chip scale package structure and method of forming the same

Fan-out package structure with integrated antenna

Semiconductor package assembly having a conductive electromagnetic...

Semiconductor package including lid structure with opening and recess

Innovative air gap for antenna fan out package

Semiconductor package structure with antenna

Fan-out package and methods of forming thereof

Semiconductor package structure including antenna

Chip scale package structure and method of forming the same

Semiconductor package structure

Semiconductor package structure with antenna

Fan-out package structure with integrated antenna

Semiconductor package with antenna and fabrication method thereof

Semiconductor package including lid structure with opening and recess

PoP device

Semiconductor package structure

Fan-out package and methods of forming thereof

Stacked fan-out package structure

Semiconductor package device

Fan-out package structure and method for forming the same

Semiconductor package assembly

Fan-out package and methods of forming thereof

Semiconductor package with improved bandwidth

Semiconductor package assembly

Fan-out POP structure with inconsecutive polymer layer

Semiconductor package device and manufacturing method thereof

Patents Applicationslast 30 patents

ANTENNA PACKAGE

Multi-Band Antenna

SEMICONDUCTOR PACKAGE STRUCTURE

BUMP STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE, METHOD OF FORMING THE SAME AND SEM...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

ANTENNA MODULE

ANTENNA AND ELECTRONIC DEVICE INCLUDING THE ANTENNA

ANTENNA DEVICE

ANTENNA

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

ANTENNA

CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING ANTENNA

CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

INNOVATIVE AIR GAP FOR ANTENNA FAN OUT PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE WITH ANTENNA

FAN-OUT PACKAGE STRUCTURE WITH INTEGRATED ANTENNA

SEMICONDUCTOR PACKAGE INCLUDING LID STRUCTURE WITH OPENING AND RECESS

SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING ANTENNA

Fan-Out Package and Methods of Forming Thereof

SEMICONDUCTOR PACKAGE STRUCTURE

CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE ASSEMBLY HAVING A CONDUCTIVE ELECTROMAGNETIC...

CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE WITH ANTENNA