Nai-Jen Hsuan

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit lead frame and semiconductor device thereof
- Patent number 12,062,598
- Issue date Aug 13, 2024
- Realtek Semiconductor Corp.
- Yu-Hsin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package and package substrate thereof
- Patent number 11,621,221
- Issue date Apr 4, 2023
- Realtek Semiconductor Corp.
- Che-Ming Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069995
- Publication date Feb 27, 2025
- Realtek Semiconductor Corp.
- Nai-Jen Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250029902
- Publication date Jan 23, 2025
- Realtek Semiconductor Corp.
- Nai-Jen Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT LEAD FRAME AND SEMICONDUCTOR DEVICE THEREOF
- Publication number 20220238419
- Publication date Jul 28, 2022
- Realtek Semiconductor Corp.
- Yu-Hsin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE AND PACKAGE SUBSTRATE THEREOF
- Publication number 20220139817
- Publication date May 5, 2022
- Realtek Semiconductor Corp.
- Che-Ming Hsu
- H01 - BASIC ELECTRIC ELEMENTS