Nalla Praveen

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interlevel conductor pre-fill utilizing selective barrier deposition
- Patent number 10,262,943
- Issue date Apr 16, 2019
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for wet metal seed deposition for bottom up gapfill of feat...
- Patent number 10,103,056
- Issue date Oct 16, 2018
- Lam Research Corporation
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel conductor pre-fill utilizing selective barrier deposition
- Patent number 9,875,968
- Issue date Jan 23, 2018
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching for enhanced bottom-up feature fill
- Patent number 9,837,312
- Issue date Dec 5, 2017
- Lam Research Corporation
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of electroless plating using a solution with at least two bo...
- Patent number 9,818,617
- Issue date Nov 14, 2017
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual damascene fill
- Patent number 9,768,063
- Issue date Sep 19, 2017
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel conductor pre-fill utilizing selective barrier deposition
- Patent number 9,583,386
- Issue date Feb 28, 2017
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating solution with at least two borane containing re...
- Patent number 9,551,074
- Issue date Jan 24, 2017
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Two-step deposition with improved selectivity
- Patent number 9,353,444
- Issue date May 31, 2016
- Lam Research Corporation
- Artur Kolics
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Using electroless deposition as a metrology tool to highlight conta...
- Patent number 9,287,183
- Issue date Mar 15, 2016
- Lam Research Corporation
- Larry Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via metallization
- Patent number 9,029,258
- Issue date May 12, 2015
- Lam Research Corporation
- Praveen Reddy Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless copper deposition
- Patent number 8,946,087
- Issue date Feb 3, 2015
- Lam Research Corporation
- Praveen Reddy Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and layers for metallization
- Patent number 8,736,055
- Issue date May 27, 2014
- Lam Research Corporation
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal methods for cleaning post-CMP wafers
- Patent number 7,884,017
- Issue date Feb 8, 2011
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal methods for cleaning post-CMP wafers
- Patent number 7,709,400
- Issue date May 4, 2010
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR WET METAL SEED DEPOSITION FOR BOTTOM UP GAPFILL OF FEAT...
- Publication number 20180261502
- Publication date Sep 13, 2018
- LAM RESEARCH CORPORATION
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
- Publication number 20180151503
- Publication date May 31, 2018
- LAM RESEARCH CORPORATION
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
- Publication number 20170162512
- Publication date Jun 8, 2017
- LAM RESEARCH CORPORATION
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS PLATING SOLUTION WITH AT LEAST TWO BORANE CONTAINING RE...
- Publication number 20170092499
- Publication date Mar 30, 2017
- LAM RESEARCH CORPORATION
- Artur KOLICS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TWO-STEP DEPOSITION WITH IMPROVED SELECTIVITY
- Publication number 20160273113
- Publication date Sep 22, 2016
- LAM RESEARCH CORPORATION
- Artur KOLICS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
- Publication number 20160118296
- Publication date Apr 28, 2016
- LAM RESEARCH CORPORATION
- Artur Kolics
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS PLATING WITH AT LEAST TWO BORANE REDUCING AGENTS
- Publication number 20150354064
- Publication date Dec 10, 2015
- LAM RESEARCH CORPORATION
- Artur KOLICS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TWO-STEP DEPOSITION WITH IMPROVED SELECTIVITY
- Publication number 20150275374
- Publication date Oct 1, 2015
- LAM RESEARCH CORPORATION
- Artur KOLICS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH SILICON VIA METALLIZATION
- Publication number 20140217590
- Publication date Aug 7, 2014
- LAM RESEARCH CORPORATION
- Praveen Reddy NALLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND LAYERS FOR METALLIZATION
- Publication number 20130228923
- Publication date Sep 5, 2013
- ARTUR KOLICS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS COPPER DEPOSITION
- Publication number 20130203249
- Publication date Aug 8, 2013
- LAM RESEARCH CORPORATION
- Praveen Reddy NALLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL METHODS FOR CLEANING POST-CMP WAFERS
- Publication number 20100136788
- Publication date Jun 3, 2010
- LAM RESEARCH CORPORATION
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self assembled monolayer for improving adhesion between copper and...
- Publication number 20090304914
- Publication date Dec 10, 2009
- LAM RESEARCH CORPORATION
- Praveen Nalla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Thermal methods for cleaning post-CMP wafers
- Publication number 20080280456
- Publication date Nov 13, 2008
- Lam Research Corporation
- Zhonghui Alex Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-limiting plating method
- Publication number 20080152823
- Publication date Jun 26, 2008
- Lam Research Corporation
- John Boyd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Nalla Praveen

Person

Patents Grantslast 30 patents

Interlevel conductor pre-fill utilizing selective barrier deposition

Methods for wet metal seed deposition for bottom up gapfill of feat...

Interlevel conductor pre-fill utilizing selective barrier deposition

Atomic layer etching for enhanced bottom-up feature fill

Method of electroless plating using a solution with at least two bo...

Dual damascene fill

Interlevel conductor pre-fill utilizing selective barrier deposition

Electroless plating solution with at least two borane containing re...

Two-step deposition with improved selectivity

Using electroless deposition as a metrology tool to highlight conta...

Through silicon via metallization

Electroless copper deposition

Methods and layers for metallization

Thermal methods for cleaning post-CMP wafers

Thermal methods for cleaning post-CMP wafers

Patents Applicationslast 30 patents

METHODS FOR WET METAL SEED DEPOSITION FOR BOTTOM UP GAPFILL OF FEAT...

Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition

Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition

ELECTROLESS PLATING SOLUTION WITH AT LEAST TWO BORANE CONTAINING RE...

TWO-STEP DEPOSITION WITH IMPROVED SELECTIVITY

Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition

ELECTROLESS PLATING WITH AT LEAST TWO BORANE REDUCING AGENTS

TWO-STEP DEPOSITION WITH IMPROVED SELECTIVITY

THROUGH SILICON VIA METALLIZATION

METHODS AND LAYERS FOR METALLIZATION

ELECTROLESS COPPER DEPOSITION

THERMAL METHODS FOR CLEANING POST-CMP WAFERS

Self assembled monolayer for improving adhesion between copper and...

Thermal methods for cleaning post-CMP wafers

Self-limiting plating method