Namiki Moriga

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device including a bump for...
- Patent number 7,510,958
- Issue date Mar 31, 2009
- Renesas Technology Corp.
- Tetsuya Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including a bump for...
- Patent number 7,153,764
- Issue date Dec 26, 2006
- Renesas Technology Corp.
- Tetsuya Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having tie bars for in...
- Patent number 6,602,738
- Issue date Aug 5, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Zhikang Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,600,218
- Issue date Jul 29, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Fumiaki Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounted in resin sealed container
- Patent number 5,977,628
- Issue date Nov 2, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Namiki Moriga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device improved in light shielding property and light...
- Patent number 5,394,014
- Issue date Feb 28, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including package with improved base-to-cop seal
- Patent number 5,323,058
- Issue date Jun 21, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Namiki Moriga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device improved in light shielding property and light...
- Patent number 5,317,195
- Issue date May 31, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing a semiconductor device including a bump for...
- Publication number 20070077746
- Publication date Apr 5, 2007
- Renesas Technology Corp.
- Tetsuya Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device including a bump for...
- Publication number 20050074958
- Publication date Apr 7, 2005
- RENESAS TECHNOLOGY CORP.
- Tetsuya Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device having tie bars for in...
- Publication number 20030096455
- Publication date May 22, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Zhikang Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030052394
- Publication date Mar 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Fumiaki Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Base interconnection substrate, manufacturing method thereof, semic...
- Publication number 20020149121
- Publication date Oct 17, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Taketoshi Shikano
- H01 - BASIC ELECTRIC ELEMENTS

Namiki Moriga

Person

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device including a bump for...

Method of manufacturing a semiconductor device including a bump for...

Method of manufacturing semiconductor device having tie bars for in...

Semiconductor device

Semiconductor device mounted in resin sealed container

Semiconductor device improved in light shielding property and light...

Semiconductor device including package with improved base-to-cop seal

Semiconductor device improved in light shielding property and light...

Patents Applicationslast 30 patents

Method of manufacturing a semiconductor device including a bump for...

Method of manufacturing a semiconductor device including a bump for...

Method of manufacturing semiconductor device having tie bars for in...

Semiconductor device

Base interconnection substrate, manufacturing method thereof, semic...