Namil KOO

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer inspection apparatuses
- Patent number 11,688,623
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Racine Elysia Auxter Nassau
- G01 - MEASURING TESTING
Information Patent Grant
Hybrid probe, physical property analysis apparatus including the sa...
- Patent number 11,680,898
- Issue date Jun 20, 2023
- Samsung Electronics Co., Ltd.
- Junbum Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe for detecting near field and near-field detecting system incl...
- Patent number 11,579,168
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ikseon Jeon
- G01 - MEASURING TESTING
Information Patent Grant
Probe for detecting near field and near-field detection system incl...
- Patent number 11,579,167
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Jongmin Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition for adhesion, stacked structure using the same, and ele...
- Patent number 10,611,937
- Issue date Apr 7, 2020
- Samsung Electronics Co., Ltd.
- Minchul Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...
- Publication number 20240399506
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Sang Min Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER
- Publication number 20240234216
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Inkeun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERAHERTZ SIGNAL MEASURING APPARATUS AND MEASURING METHOD
- Publication number 20240230528
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Sunhong Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION LITHOGRAPHIC SYSTEM
- Publication number 20240152058
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Wonki LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER
- Publication number 20240136232
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Inkeun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE AND INSPECTION APPARATUS INCLUDING THE SAME
- Publication number 20240019362
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Junbum Park
- G01 - MEASURING TESTING
Information Patent Application
TERAHERTZ PROBE
- Publication number 20230417820
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Martin Priwisch
- G01 - MEASURING TESTING
Information Patent Application
PROBE FOR DETECTING NEAR FIELD AND NEAR-FIELD DETECTING SYSTEM INCL...
- Publication number 20220155340
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Ikseon Jeon
- G01 - MEASURING TESTING
Information Patent Application
PROBE FOR DETECTING NEAR FIELD AND NEAR-FIELD DETECTION SYSTEM INCL...
- Publication number 20220082584
- Publication date Mar 17, 2022
- Samsung Electronics Co., Ltd.
- Jongmin YOON
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR SUBS...
- Publication number 20220037215
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Inkeun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PROBE, PHYSICAL PROPERTY ANALYSIS APPARATUS INCLUDING THE SA...
- Publication number 20220011225
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Junbum PARK
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION APPARATUS OF WAFER
- Publication number 20210366102
- Publication date Nov 25, 2021
- Samsung Electronics Co., Ltd.
- Suhwan PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER INSPECTION APPARATUSES
- Publication number 20210057262
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Racine Elysia Auxter NASSAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR ADHESION, STACKED STRUCTURE USING THE SAME, AND ELE...
- Publication number 20180273816
- Publication date Sep 27, 2018
- Samsung Electronics Co., Ltd.
- Minchul LEE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Wafer inspection apparatuses

Hybrid probe, physical property analysis apparatus including the sa...

Probe for detecting near field and near-field detecting system incl...

Probe for detecting near field and near-field detection system incl...

Composition for adhesion, stacked structure using the same, and ele...

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...

METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER

TERAHERTZ SIGNAL MEASURING APPARATUS AND MEASURING METHOD

IMMERSION LITHOGRAPHIC SYSTEM

METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER

PROBE AND INSPECTION APPARATUS INCLUDING THE SAME

TERAHERTZ PROBE

PROBE FOR DETECTING NEAR FIELD AND NEAR-FIELD DETECTING SYSTEM INCL...

PROBE FOR DETECTING NEAR FIELD AND NEAR-FIELD DETECTION SYSTEM INCL...

SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR SUBS...

HYBRID PROBE, PHYSICAL PROPERTY ANALYSIS APPARATUS INCLUDING THE SA...

INSPECTION APPARATUS OF WAFER

WAFER INSPECTION APPARATUSES

COMPOSITION FOR ADHESION, STACKED STRUCTURE USING THE SAME, AND ELE...