NamJu Cho

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of integrating RF antenna interpose...
- Patent number 12,100,663
- Issue date Sep 24, 2024
- STATS ChipPAC Pte. Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for performing service discovery in el...
- Patent number 11,765,245
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Buseop Jung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of integrating RF antenna interpose...
- Patent number 11,735,530
- Issue date Aug 22, 2023
- STATS ChipPAC Pte. Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for transmitting signals in plurality of frequenc...
- Patent number 11,503,451
- Issue date Nov 15, 2022
- Samsung Electronics Co., Ltd.
- Buseop Jung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device and method for forming Wi-Fi direct group thereof
- Patent number 11,297,666
- Issue date Apr 5, 2022
- Samsung Electronics Co., Ltd.
- Hyejung Bang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and apparatus for allocating IP address in wireless communic...
- Patent number 11,284,248
- Issue date Mar 22, 2022
- Samsung Electronics Co., Ltd.
- Jongmu Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of using leadframe bodies to form o...
- Patent number 10,903,183
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for forming Wi-Fi direct group thereof
- Patent number 10,674,555
- Issue date Jun 2, 2020
- Samsung Electronics Co., Ltd.
- Hyejung Bang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming ultra thin multi-die fac...
- Patent number 10,573,600
- Issue date Feb 25, 2020
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for establishing communication connection
- Patent number 10,548,178
- Issue date Jan 28, 2020
- Samsung Electronics Co., Ltd.
- Bu-Seop Jung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming 3D dual side die embedde...
- Patent number 10,510,703
- Issue date Dec 17, 2019
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for allocating IP address in wireless communic...
- Patent number 10,397,773
- Issue date Aug 27, 2019
- Samsung Electronics Co., Ltd.
- Jongmu Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming interposer frame electri...
- Patent number 9,966,335
- Issue date May 8, 2018
- STATS ChipPAC Pte. Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical interconnect in...
- Patent number 9,842,808
- Issue date Dec 12, 2017
- STATS ChipPAC Pte. Ltd.
- HanGil Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with joint assembly and method...
- Patent number 9,748,157
- Issue date Aug 29, 2017
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra thin multi-die fac...
- Patent number 9,735,113
- Issue date Aug 15, 2017
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for discovering device in wireless communicati...
- Patent number 9,730,256
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Changsoon Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming 3D dual side die embedde...
- Patent number 9,691,707
- Issue date Jun 27, 2017
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for allocating IP address in wireless communic...
- Patent number 9,578,494
- Issue date Feb 21, 2017
- Samsung Electronics Co., Ltd.
- Jongmu Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device with thin profile WLCSP with vertical intercon...
- Patent number 9,558,965
- Issue date Jan 31, 2017
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive jumper traces
- Patent number 9,508,635
- Issue date Nov 29, 2016
- STATS ChipPAC Pte. Ltd.
- HanGil Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier system with multi-tier conductive posts and method of manuf...
- Patent number 9,496,152
- Issue date Nov 15, 2016
- STATS ChipPAC Pte. Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pre-molded semiconductor...
- Patent number 9,397,050
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- HanGil Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming 3D dual side die embedde...
- Patent number 9,362,161
- Issue date Jun 7, 2016
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package stacking system with shielding and metho...
- Patent number 9,355,939
- Issue date May 31, 2016
- Stats Chippac Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with single metal layer interpo...
- Patent number 9,299,650
- Issue date Mar 29, 2016
- Stats Chippac Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making an embedded wafer level b...
- Patent number 9,269,691
- Issue date Feb 23, 2016
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thin profile WLCSP with vertical intercon...
- Patent number 9,269,595
- Issue date Feb 23, 2016
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
- Patent number 9,263,332
- Issue date Feb 16, 2016
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive posts and hea...
- Patent number 9,064,859
- Issue date Jun 23, 2015
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE, AND METHOD BY WHICH ELECTRONIC DEVICE PERFORMS C...
- Publication number 20240056808
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Hakkwan KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE FOR DEVICE-PROVISIONING IN WIRELESS NETWORK, AND...
- Publication number 20240049266
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Dooho LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE FOR PERFORMING WI-FI DIRECT GROUP COMMUNICATION,...
- Publication number 20240015209
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Soonho LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR MANAGING PERSISTENT GROUP INFORMATION OF ELECTRONIC DEVICE
- Publication number 20230396671
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Namju CHO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR SETTING UP A DATA PATH
- Publication number 20230379705
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- Buseop JUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE FOR PROVIDING INFORMATION OF ACCESS POINT IN WIRE...
- Publication number 20230362711
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Hyejung BANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Device and Method of Integrating RF Antenna Interpose...
- Publication number 20230343720
- Publication date Oct 26, 2023
- STATS ChipPAC Pte Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE FOR WLAN COMMUNICATION WITH PLURALITY OF EXTERNAL...
- Publication number 20230189104
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Buseop JUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Device and Method of Forming RDL Hybrid Interposer Su...
- Publication number 20230119181
- Publication date Apr 20, 2023
- STATS ChipPAC Pte Ltd.
- JongTae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Integrating RF Antenna Interpose...
- Publication number 20230067475
- Publication date Mar 2, 2023
- STATS ChipPAC Pte Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE FOR TRANSMITTING AND RECEIVING NETWORK CONFIGURAT...
- Publication number 20220256327
- Publication date Aug 11, 2022
- Samsung Electronics Co., Ltd.
- Wonjun JANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PERFORMING SERVICE DISCOVERY IN EL...
- Publication number 20220182453
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Buseop JUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DEVICE AND METHOD FOR TRANSMITTING SIGNALS IN PLURALITY OF FREQUENC...
- Publication number 20200404477
- Publication date Dec 24, 2020
- Samsung Electronics Co., Ltd.
- Buseop JUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FORMING WI-FI DIRECT GROUP THEREOF
- Publication number 20200288521
- Publication date Sep 10, 2020
- Samsung Electronics Co., Ltd.
- Hyejung BANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND APPARATUS FOR ALLOCATING IP ADDRESS IN WIRELESS COMMUNIC...
- Publication number 20190335322
- Publication date Oct 31, 2019
- Samsung Electronics Co., Ltd.
- Jongmu Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FORMING WI-FI DIRECT GROUP THEREOF
- Publication number 20190053302
- Publication date Feb 14, 2019
- Samsung Electronics Co., Ltd.
- Hyejung BANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND APPARATUS FOR ALLOCATING IP ADDRESS IN WIRELESS COMMUNIC...
- Publication number 20180139605
- Publication date May 17, 2018
- Samsung Electronics Co., Ltd.
- Jongmu Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...
- Publication number 20170309572
- Publication date Oct 26, 2017
- STATS ChipPAC Pte Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming 3D Dual Side Die Embedde...
- Publication number 20170250154
- Publication date Aug 31, 2017
- STATS ChipPAC Pte Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ESTABLISHING COMMUNICATION CONNECTION
- Publication number 20170196034
- Publication date Jul 6, 2017
- Samsung Electronics Co., Ltd.
- Bu-Seop Jung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND APPARATUS FOR ALLOCATING IP ADDRESS IN WIRELESS COMMUNIC...
- Publication number 20170164188
- Publication date Jun 8, 2017
- Samsung Electronics Co., Ltd.
- Jongmu Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Device and Method of Forming 3D Dual Side Die Embedde...
- Publication number 20160233168
- Publication date Aug 11, 2016
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming 3D Dual Side Die Embedde...
- Publication number 20150270237
- Publication date Sep 24, 2015
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DISCOVERING DEVICE IN WIRELESS COMMUNICATI...
- Publication number 20150257191
- Publication date Sep 10, 2015
- Samsung Electronics Co., Ltd.
- Changsoon KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Electri...
- Publication number 20150123273
- Publication date May 7, 2015
- STATS ChipPAC, Ltd.
- NamJu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Embedded Wafer Level B...
- Publication number 20150091157
- Publication date Apr 2, 2015
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Conductive Materials on Contact Pads
- Publication number 20150004750
- Publication date Jan 1, 2015
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Conductive Jumper Traces
- Publication number 20150004748
- Publication date Jan 1, 2015
- STATS ChipPAC, Ltd.
- HanGil Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Embedded Wafer Level B...
- Publication number 20140367848
- Publication date Dec 18, 2014
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using Leadframe Bodies to Form O...
- Publication number 20140361423
- Publication date Dec 11, 2014
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method of integrating RF antenna interpose...

Electronic device and method for performing service discovery in el...

Semiconductor device and method of integrating RF antenna interpose...

Device and method for transmitting signals in plurality of frequenc...

Electronic device and method for forming Wi-Fi direct group thereof

Method and apparatus for allocating IP address in wireless communic...

Semiconductor device and method of using leadframe bodies to form o...

Electronic device and method for forming Wi-Fi direct group thereof

Semiconductor device and method of forming ultra thin multi-die fac...

Method and device for establishing communication connection

Semiconductor device and method of forming 3D dual side die embedde...

Method and apparatus for allocating IP address in wireless communic...

Semiconductor device and method of forming interposer frame electri...

Semiconductor device and method of forming vertical interconnect in...

Integrated circuit packaging system with joint assembly and method...

Semiconductor device and method of forming ultra thin multi-die fac...

Method and apparatus for discovering device in wireless communicati...

Semiconductor device and method of forming 3D dual side die embedde...

Method and apparatus for allocating IP address in wireless communic...

Semiconductor device with thin profile WLCSP with vertical intercon...

Methods of forming conductive jumper traces

Carrier system with multi-tier conductive posts and method of manuf...

Semiconductor device and method of forming pre-molded semiconductor...

Semiconductor device and method of forming 3D dual side die embedde...

Integrated circuit package stacking system with shielding and metho...

Integrated circuit packaging system with single metal layer interpo...

Semiconductor device and method of making an embedded wafer level b...

Semiconductor device with thin profile WLCSP with vertical intercon...

Semiconductor device and method of forming open cavity in TSV inter...

Semiconductor device and method of forming conductive posts and hea...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE, AND METHOD BY WHICH ELECTRONIC DEVICE PERFORMS C...

ELECTRONIC DEVICE FOR DEVICE-PROVISIONING IN WIRELESS NETWORK, AND...

ELECTRONIC DEVICE FOR PERFORMING WI-FI DIRECT GROUP COMMUNICATION,...

METHOD FOR MANAGING PERSISTENT GROUP INFORMATION OF ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD FOR SETTING UP A DATA PATH

ELECTRONIC DEVICE FOR PROVIDING INFORMATION OF ACCESS POINT IN WIRE...

Semiconductor Device and Method of Integrating RF Antenna Interpose...

ELECTRONIC DEVICE FOR WLAN COMMUNICATION WITH PLURALITY OF EXTERNAL...

Semiconductor Device and Method of Forming RDL Hybrid Interposer Su...

Semiconductor Device and Method of Integrating RF Antenna Interpose...

ELECTRONIC DEVICE FOR TRANSMITTING AND RECEIVING NETWORK CONFIGURAT...

ELECTRONIC DEVICE AND METHOD FOR PERFORMING SERVICE DISCOVERY IN EL...

DEVICE AND METHOD FOR TRANSMITTING SIGNALS IN PLURALITY OF FREQUENC...

ELECTRONIC DEVICE AND METHOD FOR FORMING WI-FI DIRECT GROUP THEREOF

METHOD AND APPARATUS FOR ALLOCATING IP ADDRESS IN WIRELESS COMMUNIC...

ELECTRONIC DEVICE AND METHOD FOR FORMING WI-FI DIRECT GROUP THEREOF

METHOD AND APPARATUS FOR ALLOCATING IP ADDRESS IN WIRELESS COMMUNIC...

Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...

Semiconductor Device and Method of Forming 3D Dual Side Die Embedde...

METHOD AND DEVICE FOR ESTABLISHING COMMUNICATION CONNECTION

METHOD AND APPARATUS FOR ALLOCATING IP ADDRESS IN WIRELESS COMMUNIC...

Semiconductor Device and Method of Forming 3D Dual Side Die Embedde...

Semiconductor Device and Method of Forming 3D Dual Side Die Embedde...

METHOD AND APPARATUS FOR DISCOVERING DEVICE IN WIRELESS COMMUNICATI...

Semiconductor Device and Method of Forming Interposer Frame Electri...

Semiconductor Device and Method of Making an Embedded Wafer Level B...

Methods of Forming Conductive Materials on Contact Pads

Methods of Forming Conductive Jumper Traces

Semiconductor Device and Method of Making an Embedded Wafer Level B...

Semiconductor Device and Method of Using Leadframe Bodies to Form O...