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Namseog Kim
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Yongin-si, KR
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device comprising a through electrode and a pad conne...
Patent number
8,324,733
Issue date
Dec 4, 2012
Samsung Electronics Co., Ltd.
In Young Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Through-silicon via structures including conductive protective layers
Patent number
8,026,592
Issue date
Sep 27, 2011
Samsung Electronics Co., Ltd.
Minseung Yoon
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHODS OF FORMING THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCT...
Publication number
20110318917
Publication date
Dec 29, 2011
Minseung Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20100252935
Publication date
Oct 7, 2010
In Young Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCTIVE PROTECTIVE LAYE...
Publication number
20100038800
Publication date
Feb 18, 2010
SAMSUNG ELECTRONICS CO., LTD.
Minseung Yoon
H01 - BASIC ELECTRIC ELEMENTS