Nan-Chun Lin

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Zhonghe City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,799,588
- Issue date Oct 24, 2017
- Xintec Inc.
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,822,325
- Issue date Sep 2, 2014
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for fabricating the same
- Patent number 8,541,877
- Issue date Sep 24, 2013
- Chia-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140332985
- Publication date Nov 13, 2014
- Ching-Yu NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130316499
- Publication date Nov 28, 2013
- Xintec Inc.
- Ching-Yu NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110140267
- Publication date Jun 16, 2011
- Chia-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110127681
- Publication date Jun 2, 2011
- Ching-Yu NI
- H01 - BASIC ELECTRIC ELEMENTS