Nan-Chun Lin

Follow

Person

Hukou Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional system-in-package package-on-package structure
- Patent number 8,619,431
- Issue date Dec 31, 2013
- ADL Engineering Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molding system and method of chip package
- Patent number 8,293,572
- Issue date Oct 23, 2012
- ADL Engineering Inc.
- Wen-Chuan Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
EMI Shielding in a Package Module
- Publication number 20120188727
- Publication date Jul 26, 2012
- ADL Engineering Inc.
- Nan-Chun LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDING SYSTEM AND METHOD OF CHIP PACKAGE
- Publication number 20120187582
- Publication date Jul 26, 2012
- ADL Engineering Inc.
- Wen-Chuan Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
THREE-DIMENSIONAL SYSTEM-IN-PACKAGE PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20120161315
- Publication date Jun 28, 2012
- ADL Engineering Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS