Nan-Jung CHEN

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,908,759
- Issue date Feb 20, 2024
- Mediatek Inc.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board design for high speed application
- Patent number 11,903,121
- Issue date Feb 13, 2024
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-in-package with frequency-selective surface structure
- Patent number 11,848,481
- Issue date Dec 19, 2023
- Mediatek Inc.
- Shih-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
- Patent number 11,837,552
- Issue date Dec 5, 2023
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 11,721,882
- Issue date Aug 8, 2023
- Mediatek Inc.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spectrometer
- Patent number 11,513,067
- Issue date Nov 29, 2022
- InnoSpectra Corporation
- Fei-Peng Chang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
- Patent number 11,373,957
- Issue date Jun 28, 2022
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-in-package with frequency-selective surface structure
- Patent number 11,322,823
- Issue date May 3, 2022
- Mediatek Inc.
- Shih-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using flip-chip technology
- Patent number 10,991,669
- Issue date Apr 27, 2021
- Mediatek Inc.
- Che-Ya Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 10,847,869
- Issue date Nov 24, 2020
- Mediatek Inc.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,784,206
- Issue date Sep 22, 2020
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board design for high speed application
- Patent number 10,772,191
- Issue date Sep 8, 2020
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Over the air wireless test system for testing microelectronic devic...
- Patent number 10,680,727
- Issue date Jun 9, 2020
- Mediatek Inc.
- Yen-Ju Lu
- G01 - MEASURING TESTING
Information Patent Grant
Fan-out package structure having stacked carrier substrates and met...
- Patent number 10,515,887
- Issue date Dec 24, 2019
- Mediatek Inc.
- Shih-Yi Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board design for high speed application
- Patent number 10,485,095
- Issue date Nov 19, 2019
- Mediatek, Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SGS or GSGSG pattern for signal transmitting channel, and PCB assem...
- Patent number 10,426,035
- Issue date Sep 24, 2019
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of determining quality of a light source
- Patent number RE47272
- Issue date Mar 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Nan-Jung Chen
Information Patent Grant
Semiconductor package
- Patent number 10,211,134
- Issue date Feb 19, 2019
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of determining quality of a light source
- Patent number RE47197
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Nan-Jung Chen
Information Patent Grant
Semiconductor package
- Patent number 10,163,767
- Issue date Dec 25, 2018
- Mediatek Inc.
- Nan-Jang Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out package structure
- Patent number 10,128,192
- Issue date Nov 13, 2018
- Mediatek Inc.
- Min-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package incorporating redistribution layer interposer
- Patent number 10,103,128
- Issue date Oct 16, 2018
- Mediatek Inc.
- Che-Ya Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Early power compensation method and apparatus thereof
- Patent number 10,019,048
- Issue date Jul 10, 2018
- Mediatek Inc.
- Nan-Jang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for treating pain and method for screening pharmaceutical co...
- Patent number 9,999,658
- Issue date Jun 19, 2018
- National Sun Yat-sen University
- Zhi-Hong Wen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of segmenting single neuron images with high-dynamic-range t...
- Patent number 10,002,425
- Issue date Jun 19, 2018
- National Tsing Hua University
- Chi-Tin Shih
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
SGS or GSGSG pattern for signal transmitting channel, and PCB assem...
- Patent number 9,955,581
- Issue date Apr 24, 2018
- Mediatek Inc.
- Nan-Jang Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board design for high speed application
- Patent number 9,949,360
- Issue date Apr 17, 2018
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board design for high speed application
- Patent number 9,913,365
- Issue date Mar 6, 2018
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,852,966
- Issue date Dec 26, 2017
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout method for printed circuit board
- Patent number 9,846,756
- Issue date Dec 19, 2017
- Mediatek Inc.
- Fu-Kang Pan
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105111
- Publication date Mar 27, 2025
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
- Publication number 20220353985
- Publication date Nov 3, 2022
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LAYER STRUCTURES, ANTENNA LAYER AND ELEC...
- Publication number 20220352084
- Publication date Nov 3, 2022
- MEDIATEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-IN-PACKAGE WITH FREQUENCY-SELECTIVE SURFACE STRUCTURE
- Publication number 20220302574
- Publication date Sep 22, 2022
- MEDIATEK INC.
- Shih-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SAMPLE CARRIER AND SPECTROMETER
- Publication number 20210262928
- Publication date Aug 26, 2021
- InnoSpectra Corporation
- Fei-Peng Chang
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY
- Publication number 20210202425
- Publication date Jul 1, 2021
- MEDIATEK INC.
- Che-Ya CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210193540
- Publication date Jun 24, 2021
- MEDIATEK INC.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
- Publication number 20210036405
- Publication date Feb 4, 2021
- MEDIATEK INC.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200381365
- Publication date Dec 3, 2020
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
- Publication number 20200352023
- Publication date Nov 5, 2020
- MEDIATEK INC.
- Nan-Jang Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
- Publication number 20200022251
- Publication date Jan 16, 2020
- MEDIATEK INC.
- Nan-Jang Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE FOR HIGH-DATA RATE COMMUNICATION APPLICATIONS
- Publication number 20190355697
- Publication date Nov 21, 2019
- MEDIATEK INC.
- Min-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-IN-PACKAGE WITH FREQUENCY-SELECTIVE SURFACE STRUCTURE
- Publication number 20190115646
- Publication date Apr 18, 2019
- MEDIATEK INC.
- Shih-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVER THE AIR WIRELESS TEST SYSTEM FOR TESTING MICROELECTRONIC DEVIC...
- Publication number 20190068300
- Publication date Feb 28, 2019
- MEDIATEK INC.
- Yen-Ju Lu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190051609
- Publication date Feb 14, 2019
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
- Publication number 20180358685
- Publication date Dec 13, 2018
- MEDIATEK INC.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SGS OR GSGSG PATTERN FOR SIGNAL TRANSMITTING CHANNEL, AND PCB ASSEM...
- Publication number 20180206339
- Publication date Jul 19, 2018
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
- Publication number 20180146543
- Publication date May 24, 2018
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180102298
- Publication date Apr 12, 2018
- MEDIATEK INC.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180096922
- Publication date Apr 5, 2018
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE HAVING STACKED CARRIER SUBSTRATES AND MET...
- Publication number 20180082936
- Publication date Mar 22, 2018
- MEDIATEK INC.
- Shih-Yi SYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-BUMPED REDISTRIBUTION LAYER STRUCTURE AND SEMICONDUCTOR PACKAGE...
- Publication number 20180053665
- Publication date Feb 22, 2018
- MEDIATEK INC.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE
- Publication number 20180025985
- Publication date Jan 25, 2018
- MEDIATEK INC.
- Min-Chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180019192
- Publication date Jan 18, 2018
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEGMENTING SINGLE NEURON IMAGES WITH HIGH-DYNAMIC-RANGE T...
- Publication number 20180018767
- Publication date Jan 18, 2018
- National Tsing-Hua University
- Chi-Tin SHIH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCORPORATING REDISTRIBUTION LAYER INTERPOSER
- Publication number 20170243858
- Publication date Aug 24, 2017
- MEDIATEK INC.
- Che-Ya Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY TOOL AND METHOD THEREOF
- Publication number 20170123328
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Feng LIAO
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR TREATING PAIN AND METHOD FOR SCREENING PHARMACEUTICAL CO...
- Publication number 20170087222
- Publication date Mar 30, 2017
- NATIONAL SUN YAT-SEN UNIVERSITY
- Zhi-Hong Wen
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY
- Publication number 20160358877
- Publication date Dec 8, 2016
- MEDIATEK INC.
- Che-Ya CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160300812
- Publication date Oct 13, 2016
- MEDIATEK INC.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Nan-Jung CHEN

Person

Patents Grantslast 30 patents

Semiconductor device

Printed circuit board design for high speed application

Antenna-in-package with frequency-selective surface structure

Semiconductor package with layer structures, antenna layer and elec...

Semiconductor package having discrete antenna device

Spectrometer

Semiconductor package with layer structures, antenna layer and elec...

Antenna-in-package with frequency-selective surface structure

Semiconductor package using flip-chip technology

Semiconductor package having discrete antenna device

Semiconductor package

Printed circuit board design for high speed application

Over the air wireless test system for testing microelectronic devic...

Fan-out package structure having stacked carrier substrates and met...

Printed circuit board design for high speed application

SGS or GSGSG pattern for signal transmitting channel, and PCB assem...

Methods of determining quality of a light source

Semiconductor package

Methods of determining quality of a light source

Semiconductor package

Fan-out package structure

Semiconductor package incorporating redistribution layer interposer

Early power compensation method and apparatus thereof

Method for treating pain and method for screening pharmaceutical co...

Method of segmenting single neuron images with high-dynamic-range t...

SGS or GSGSG pattern for signal transmitting channel, and PCB assem...

Printed circuit board design for high speed application

Printed circuit board design for high speed application

Semiconductor package

Layout method for printed circuit board

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION

SEMICONDUCTOR PACKAGE WITH LAYER STRUCTURES, ANTENNA LAYER AND ELEC...

ANTENNA-IN-PACKAGE WITH FREQUENCY-SELECTIVE SURFACE STRUCTURE

SAMPLE CARRIER AND SPECTROMETER

SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE

SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION

PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION

ELECTRONIC PACKAGE FOR HIGH-DATA RATE COMMUNICATION APPLICATIONS

ANTENNA-IN-PACKAGE WITH FREQUENCY-SELECTIVE SURFACE STRUCTURE

OVER THE AIR WIRELESS TEST SYSTEM FOR TESTING MICROELECTRONIC DEVIC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE

SGS OR GSGSG PATTERN FOR SIGNAL TRANSMITTING CHANNEL, AND PCB ASSEM...

PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

FAN-OUT PACKAGE STRUCTURE HAVING STACKED CARRIER SUBSTRATES AND MET...

PRE-BUMPED REDISTRIBUTION LAYER STRUCTURE AND SEMICONDUCTOR PACKAGE...

FAN-OUT PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

METHOD OF SEGMENTING SINGLE NEURON IMAGES WITH HIGH-DYNAMIC-RANGE T...

SEMICONDUCTOR PACKAGE INCORPORATING REDISTRIBUTION LAYER INTERPOSER

PHOTOLITHOGRAPHY TOOL AND METHOD THEREOF

METHOD FOR TREATING PAIN AND METHOD FOR SCREENING PHARMACEUTICAL CO...

SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY

SEMICONDUCTOR PACKAGE