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Patents Grants
last 30 patents
Information
Patent Grant
Packaged semiconductor sensor device with lid
Patent number
9,416,002
Issue date
Aug 16, 2016
FREESCALE SEMICONDUCTOR, INC.
Nan Xu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Quad flat non-leaded semiconductor package with wettable flank
Patent number
9,324,637
Issue date
Apr 26, 2016
FREESCALE SEMICONDUCTOR, INC.
Zhigang Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of packaging semiconductor die with cap element
Patent number
8,859,336
Issue date
Oct 14, 2014
FREESCALE SEMICONDUCTOR, INC.
Junhua Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making chip-on-lead package
Patent number
8,642,395
Issue date
Feb 4, 2014
FREESCALE SEMICONDUCTOR, INC.
Zhe Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making semiconductor package
Patent number
8,216,886
Issue date
Jul 10, 2012
FREESCALE SEMICONDUCTOR, INC.
Bin Tian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame for semiconductor device
Patent number
8,115,288
Issue date
Feb 14, 2012
FREESCALE SEMICONDUCTOR, INC.
Yongsheng Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit package and method of packaging se...
Patent number
7,727,817
Issue date
Jun 1, 2010
FREESCALE SEMICONDUCTOR, INC.
Xuesong Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming premolded lead frame
Patent number
7,723,163
Issue date
May 25, 2010
FREESCALE SEMICONDUCTOR, INC.
Xue-song Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming land grid array packaged device
Patent number
7,056,766
Issue date
Jun 6, 2006
FREESCALE SEMICONDUCTOR, INC.
Hei Ming Shiu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE WITH INSPECTABLE SOLDER JOINTS
Publication number
20160056097
Publication date
Feb 25, 2016
Zhigang Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR SENSOR DEVICE WITH LID
Publication number
20160023894
Publication date
Jan 28, 2016
Nan Xu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE DIE ATTACHMENT
Publication number
20140284806
Publication date
Sep 25, 2014
Junhua Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QFN DEVICE AND LEAD FRAME THEREFOR
Publication number
20130049180
Publication date
Feb 28, 2013
FREESCALE SEMICONDUCTOR, INC.
Nan XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT
Publication number
20120238058
Publication date
Sep 20, 2012
FREESCALE SEMICONDUCTOR, INC.
Junhua LUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME FOR SEMICONDUCTOR DEVICE
Publication number
20110248393
Publication date
Oct 13, 2011
FREESCALE SEMICONDUCTOR, INC.
Yongsheng Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MAKING SEMICONDUCTOR PACKAGE
Publication number
20110193237
Publication date
Aug 11, 2011
FREESCALE SEMICONDUCTOR, INC.
Bin Tian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME AND METHOD OF FORMING SAME
Publication number
20110065240
Publication date
Mar 17, 2011
FREESCALE SEMICONDUCTOR, INC.
Xu GAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MAKING CHIP-ON-LEAD PACKAGE
Publication number
20100248426
Publication date
Sep 30, 2010
FREESCALE SEMICONDUCTOR, INC.
Zhe Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF PACKAGING SE...
Publication number
20090236713
Publication date
Sep 24, 2009
FREESCALE SEMICONDUCTOR, INC.
Xuesong XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING PREMOLDED LEAD FRAME
Publication number
20090098686
Publication date
Apr 16, 2009
FREESCALE SEMICONDUCTOR, INC.
Xue-song Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Land grid array packaged device and method of forming same
Publication number
20050124147
Publication date
Jun 9, 2005
Hei Ming Shiu
H01 - BASIC ELECTRIC ELEMENTS