Nancy F. Dean

Person

Liberty Lake, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of refining solder materials
- Patent number 9,666,547
- Issue date May 30, 2017
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface materials and methods of production and use thereof
- Patent number 7,608,324
- Issue date Oct 27, 2009
- Honeywell International Inc.
- My N. Nguyen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Methods of refining lead-containing materials
- Patent number 7,521,286
- Issue date Apr 21, 2009
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interconnect systems methods of production and uses thereof
- Patent number 7,256,491
- Issue date Aug 14, 2007
- Honeywell International Inc.
- Mark Fery
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic device having fibrous interface
- Patent number 6,740,972
- Issue date May 25, 2004
- Honeywell International Inc.
- Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant fibrous thermal interface
- Patent number 6,713,151
- Issue date Mar 30, 2004
- Honeywell International Inc.
- Nancy F. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferrable compliant fibrous thermal interface
- Patent number 6,676,796
- Issue date Jan 13, 2004
- Honeywell International Inc.
- Michael R. Pinter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having fibrous interface
- Patent number 6,617,199
- Issue date Sep 9, 2003
- Honeywell International Inc.
- Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferrable compliant fibrous thermal interface
- Patent number 6,436,506
- Issue date Aug 20, 2002
- Honeywell International Inc.
- Michael R. Pinter
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF REFINING SOLDER MATERIALS
- Publication number 20100206133
- Publication date Aug 19, 2010
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Interconnect System and Production Thereof
- Publication number 20090294115
- Publication date Dec 3, 2009
- Honeywell International Inc.
- Mark Fery
- G05 - CONTROLLING REGULATING
Information Patent Application
Heat spreader constructions, intergrated circuitry, methods of form...
- Publication number 20090027857
- Publication date Jan 29, 2009
- Nancy F. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interconnect System and Method of Production Thereof
- Publication number 20080029882
- Publication date Feb 7, 2008
- Honeywell International Inc.
- Mark Fery
- G05 - CONTROLLING REGULATING
Information Patent Application
Thermal interconnect and interface systems, methods of production a...
- Publication number 20070164424
- Publication date Jul 19, 2007
- Nancy Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interface materials and methods of production and use thereof
- Publication number 20070098971
- Publication date May 3, 2007
- My N. Nguyen
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Application
Lead-containing anodes
- Publication number 20070045838
- Publication date Mar 1, 2007
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-containing solder paste
- Publication number 20070045839
- Publication date Mar 1, 2007
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-containing solder bumps
- Publication number 20070045842
- Publication date Mar 1, 2007
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally conductive materials, solder preform constructions, assem...
- Publication number 20070013054
- Publication date Jan 18, 2007
- Brian D. Ruchert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of refining lead-containing materials
- Publication number 20060201279
- Publication date Sep 14, 2006
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal interconnect systems methods of production and uses thereof
- Publication number 20060151873
- Publication date Jul 13, 2006
- Mark Fery
- G05 - CONTROLLING REGULATING
Information Patent Application
Doped alloys for electrical interconnects, methods of production an...
- Publication number 20060113683
- Publication date Jun 1, 2006
- Nancy Dean
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Thermal interconnect and interface systems, methods of production a...
- Publication number 20060040112
- Publication date Feb 23, 2006
- Nancy Dean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal interface materials; and compositions comprising indium and...
- Publication number 20050040369
- Publication date Feb 24, 2005
- John N. Lalena
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Anodes for electroplating operations, and methods of forming materi...
- Publication number 20050000821
- Publication date Jan 6, 2005
- Tamara L White
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor packages; lead-containing solders and anodes; and met...
- Publication number 20040065954
- Publication date Apr 8, 2004
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device having fibrous interface
- Publication number 20010052652
- Publication date Dec 20, 2001
- Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device having fibrous interface
- Publication number 20010023968
- Publication date Sep 27, 2001
- Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transferrable compliant fibrous thermal interface
- Publication number 20010006715
- Publication date Jul 5, 2001
- Michael R. Pinter
- B32 - LAYERED PRODUCTS

Nancy F. Dean

Person

Patents Grantslast 30 patents

Method of refining solder materials

Interface materials and methods of production and use thereof

Methods of refining lead-containing materials

Thermal interconnect systems methods of production and uses thereof

Electronic device having fibrous interface

Compliant fibrous thermal interface

Transferrable compliant fibrous thermal interface

Electronic device having fibrous interface

Transferrable compliant fibrous thermal interface

Patents Applicationslast 30 patents

METHOD OF REFINING SOLDER MATERIALS

Thermal Interconnect System and Production Thereof

Heat spreader constructions, intergrated circuitry, methods of form...

Thermal Interconnect System and Method of Production Thereof

Thermal interconnect and interface systems, methods of production a...

Interface materials and methods of production and use thereof

Lead-containing anodes

Lead-containing solder paste

Lead-containing solder bumps

Thermally conductive materials, solder preform constructions, assem...

Methods of refining lead-containing materials

Thermal interconnect systems methods of production and uses thereof

Doped alloys for electrical interconnects, methods of production an...

Thermal interconnect and interface systems, methods of production a...

Thermal interface materials; and compositions comprising indium and...

Anodes for electroplating operations, and methods of forming materi...

Semiconductor packages; lead-containing solders and anodes; and met...

Electronic device having fibrous interface

Electronic device having fibrous interface

Transferrable compliant fibrous thermal interface