Nao Hattori

Person

  • Tokyo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Method of processing a substrate

    • Patent number 10,727,127
    • Issue date Jul 28, 2020
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Substrate processing method

    • Patent number 10,702,946
    • Issue date Jul 7, 2020
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Workpiece dividing method

    • Patent number 10,580,697
    • Issue date Mar 3, 2020
    • Disco Corporation
    • Nao Hattori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Workpiece dividing method

    • Patent number 10,535,565
    • Issue date Jan 14, 2020
    • Disco Corporation
    • Nao Hattori
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of processing a substrate

    • Patent number 9,831,128
    • Issue date Nov 28, 2017
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of forming gettering layer

    • Patent number 9,721,809
    • Issue date Aug 1, 2017
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Workpiece processing method

    • Patent number 9,576,835
    • Issue date Feb 21, 2017
    • Disco Corporation
    • Frank Wei
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WORKPIECE DIVIDING METHOD

    • Publication number 20190051561
    • Publication date Feb 14, 2019
    • Disco Corporation
    • Nao Hattori
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WORKPIECE DIVIDING METHOD

    • Publication number 20180301378
    • Publication date Oct 18, 2018
    • Disco Corporation
    • Nao Hattori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING A SUBSTRATE

    • Publication number 20180204771
    • Publication date Jul 19, 2018
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE PROCESSING METHOD

    • Publication number 20180161921
    • Publication date Jun 14, 2018
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING A SUBSTRATE

    • Publication number 20170076983
    • Publication date Mar 16, 2017
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WORKPIECE PROCESSING METHOD

    • Publication number 20150136312
    • Publication date May 21, 2015
    • Disco Corporation
    • Frank Wei
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    METHOD OF FORMING GETTERING LAYER

    • Publication number 20140080289
    • Publication date Mar 20, 2014
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS