Naoaki MIHARA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrically conductive adhesive agent composition, and electricall...
- Patent number 11,306,225
- Issue date Apr 19, 2022
- Furukawa Electric Co., Ltd.
- Shunichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,230,649
- Issue date Jan 25, 2022
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,193,047
- Issue date Dec 7, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,136,479
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,098,226
- Issue date Aug 24, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,066,577
- Issue date Jul 20, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electrically conductive composition
- Patent number 10,689,550
- Issue date Jun 23, 2020
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Filler material for organic electroluminescent element and method o...
- Patent number 10,084,153
- Issue date Sep 25, 2018
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition for element encapsulation for organic electronic...
- Patent number 10,043,996
- Issue date Aug 7, 2018
- Furukawa Electric Co., Ltd.
- Masami Aoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for sealing organic electroluminescent element, s...
- Patent number 9,913,324
- Issue date Mar 6, 2018
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filler material for organic electroluminescent element and method o...
- Patent number 9,793,511
- Issue date Oct 17, 2017
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent resin composition for sealing organic electroluminescen...
- Patent number 9,758,690
- Issue date Sep 12, 2017
- Furukawa Electric Co., Ltd.
- Kunihiko Ishiguro
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...
- Publication number 20190016928
- Publication date Jan 17, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...
- Publication number 20190016929
- Publication date Jan 17, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...
- Publication number 20180346766
- Publication date Dec 6, 2018
- Furukawa Electric Co., Ltd,
- Naoaki Mihara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...
- Publication number 20180346767
- Publication date Dec 6, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE AGENT COMPOSITION, AND ELECTRICALL...
- Publication number 20180346768
- Publication date Dec 6, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Shunichiro Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM
- Publication number 20180294242
- Publication date Oct 11, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM
- Publication number 20180026003
- Publication date Jan 25, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE COMPOSITION
- Publication number 20170369746
- Publication date Dec 28, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE ADHESIVE FILM
- Publication number 20170152411
- Publication date Jun 1, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...
- Publication number 20160308164
- Publication date Oct 20, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...
- Publication number 20160308165
- Publication date Oct 20, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ELEMENT ENCAPSULATION FOR ORGANIC ELECTRONIC...
- Publication number 20160020423
- Publication date Jan 21, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Keiji SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ELEMENT ENCAPSULATION FOR ORGANIC ELECTRONIC...
- Publication number 20160020426
- Publication date Jan 21, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Masami AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALANT COMPOSITION AND SEALING SHEET OBTAINED FROM THE COMPOSITION
- Publication number 20160017186
- Publication date Jan 21, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Masami Aoyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TRANSPARENT RESIN COMPOSITION FOR SEALING ORGANIC ELECTROLUMINESCEN...
- Publication number 20150291824
- Publication date Oct 15, 2015
- FURUKAWA ELECTRIC CO., LTD.
- Kunihiko ISHIGURO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION FOR SEALING ORGANIC ELECTROLUMINESCENT ELEMENT, S...
- Publication number 20150091436
- Publication date Apr 2, 2015
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Naoaki MIHARA

Person

Patents Grantslast 30 patents

Electrically conductive adhesive agent composition, and electricall...

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive composition

Filler material for organic electroluminescent element and method o...

Resin composition for element encapsulation for organic electronic...

Resin composition for sealing organic electroluminescent element, s...

Filler material for organic electroluminescent element and method o...

Transparent resin composition for sealing organic electroluminescen...

Patents Applicationslast 30 patents

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...

ELECTRICALLY CONDUCTIVE ADHESIVE AGENT COMPOSITION, AND ELECTRICALL...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM

ELECTRICALLY CONDUCTIVE COMPOSITION

CONDUCTIVE ADHESIVE FILM

FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...

FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...

RESIN COMPOSITION FOR ELEMENT ENCAPSULATION FOR ORGANIC ELECTRONIC...

RESIN COMPOSITION FOR ELEMENT ENCAPSULATION FOR ORGANIC ELECTRONIC...

SEALANT COMPOSITION AND SEALING SHEET OBTAINED FROM THE COMPOSITION

TRANSPARENT RESIN COMPOSITION FOR SEALING ORGANIC ELECTROLUMINESCEN...

RESIN COMPOSITION FOR SEALING ORGANIC ELECTROLUMINESCENT ELEMENT, S...