Naoaki Nakamura

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Optical fiber mounting method and optical module
- Patent number 10,996,403
- Issue date May 4, 2021
- Fujitsu Limited
- Takayoshi Matsumura
- G02 - OPTICS
Information Patent Grant
Composite bump, method for forming composite bump, and substrate
- Patent number 10,629,556
- Issue date Apr 21, 2020
- Fujitsu Limited
- Takashi Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module and method of manufacturing the same
- Patent number 10,591,690
- Issue date Mar 17, 2020
- Fujitsu Limited
- Akio Sugama
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 10,586,770
- Issue date Mar 10, 2020
- Fujitsu Limited
- Takayoshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 10,444,450
- Issue date Oct 15, 2019
- Fujitsu Limited
- Takayoshi Matsumura
- G02 - OPTICS
Information Patent Grant
Cooling plate and information processing device
- Patent number 10,443,957
- Issue date Oct 15, 2019
- Fujitsu Limited
- Shunichi Kikuchi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Optical module and method of manufacturing optical module
- Patent number 10,261,249
- Issue date Apr 16, 2019
- Fujitsu Limited
- Norio Kainuma
- G02 - OPTICS
Information Patent Grant
Electronic device, electronic device fabrication method, and electr...
- Patent number 10,115,694
- Issue date Oct 30, 2018
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module and method of manufacturing optical module
- Patent number 10,103,510
- Issue date Oct 16, 2018
- Fujitsu Limited
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device and electronic apparatus
- Patent number 9,817,453
- Issue date Nov 14, 2017
- Fujitsu Limited
- Naoaki Nakamura
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for manufacturing thermal interface sheet
- Patent number 9,704,775
- Issue date Jul 11, 2017
- Fujitsu Limited
- Naoaki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling plate and data processing system provided with cooling plates
- Patent number 9,642,287
- Issue date May 2, 2017
- Fujitsu Limited
- Shunichi Kikuchi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Stacked three dimensional semiconductor device with in-circuit antenna
- Patent number 9,230,964
- Issue date Jan 5, 2016
- Fujitsu Limited
- Naoaki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink device and method of repairing semiconductor device
- Patent number 9,117,788
- Issue date Aug 25, 2015
- Fujitsu Limited
- Tsuyoshi Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High-sensitive resistance measuring device and monitoring method of...
- Patent number 7,880,485
- Issue date Feb 1, 2011
- Fujitsu Limited
- Naoaki Nakamura
- G01 - MEASURING TESTING
Information Patent Grant
Reflow soldering apparatus and reflow soldering method
- Patent number 6,971,571
- Issue date Dec 6, 2005
- Fujitsu Limited
- Naoaki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor unit and cooling device
- Patent number 6,396,701
- Issue date May 28, 2002
- Fujitsu Limited
- Naoaki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL FIBER MOUNTING METHOD AND OPTICAL MODULE
- Publication number 20200363592
- Publication date Nov 19, 2020
- Fujitsu Limited
- Takayoshi Matsumura
- G02 - OPTICS
Information Patent Application
BOARD MODULE AND METHOD OF MANUFACTURING BOARD MODULE
- Publication number 20190274216
- Publication date Sep 5, 2019
- Fujitsu Limited
- TAKASHI KUBOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE
- Publication number 20190157207
- Publication date May 23, 2019
- Fujitsu Limited
- Takayoshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING PLATE AND INFORMATION PROCESSING DEVICE
- Publication number 20190093964
- Publication date Mar 28, 2019
- Fujitsu Limited
- Shunichi KIKUCHI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
OPTICAL MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180348458
- Publication date Dec 6, 2018
- Fujitsu Limited
- Akio Sugama
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20180341075
- Publication date Nov 29, 2018
- Fujitsu Limited
- Takayoshi Matsumura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMPOSITE BUMP, METHOD FOR FORMING COMPOSITE BUMP, AND SUBSTRATE
- Publication number 20180337156
- Publication date Nov 22, 2018
- Fujitsu Limited
- TAKASHI KUBOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE
- Publication number 20180217343
- Publication date Aug 2, 2018
- Fujitsu Limited
- Takayoshi Matsumura
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE
- Publication number 20180159300
- Publication date Jun 7, 2018
- Fujitsu Limited
- NORIO KAINUMA
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE
- Publication number 20180156972
- Publication date Jun 7, 2018
- Fujitsu Limited
- NORIO KAINUMA
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC DEVICE FABRICATION METHOD, AND ELECTR...
- Publication number 20170186718
- Publication date Jun 29, 2017
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND ELECTRONIC...
- Publication number 20170186719
- Publication date Jun 29, 2017
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED CHIP, LAMINATED-CHIP-MOUNTED SUBSTRATE AND MANUFACTURING...
- Publication number 20170084581
- Publication date Mar 23, 2017
- Fujitsu Limited
- Shunichi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THERMAL INTERFACE SHEET
- Publication number 20170047269
- Publication date Feb 16, 2017
- Fujitsu Limited
- Naoaki Nakamura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COOLING PLATE AND DATA PROCESSING SYSTEM PROVIDED WITH COOLING PLATES
- Publication number 20160366793
- Publication date Dec 15, 2016
- Fujitsu Limited
- Shunichi Kikuchi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20160109913
- Publication date Apr 21, 2016
- Naoaki Nakamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150162276
- Publication date Jun 11, 2015
- Fujitsu Limited
- Naoaki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE SHEET AND PROCESSOR
- Publication number 20150123259
- Publication date May 7, 2015
- Fujitsu Limited
- Naoaki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130083504
- Publication date Apr 4, 2013
- Fujitsu Limited
- Kenji FUKUZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETACHMENT OF CONNECTOR, CONNECTOR DETACHMENT TOOL, AND C...
- Publication number 20120083151
- Publication date Apr 5, 2012
- Fujitsu Limited
- Rie TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK DEVICE AND METHOD OF REPAIRING SEMICONDUCTOR DEVICE
- Publication number 20120024512
- Publication date Feb 2, 2012
- Fujitsu Limited
- Tsuyoshi Yamamoto
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HIGH-SENSITIVE RESISTANCE MEASURING DEVICE AND MONITORING METHOD OF...
- Publication number 20090058435
- Publication date Mar 5, 2009
- FUJITSU LIMITED
- Naoaki NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor package, method of production of same, printed circui...
- Publication number 20080006915
- Publication date Jan 10, 2008
- FUJITSU LIMITED
- Naoaki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component package including joint material having higher...
- Publication number 20070012477
- Publication date Jan 18, 2007
- FUJITSU LIMITED
- Naoaki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making printed wiring board and method of forming plating...
- Publication number 20060169591
- Publication date Aug 3, 2006
- FUJITSU LIMITED
- Manabu Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reflow soldering apparatus and reflow soldering method
- Publication number 20030213833
- Publication date Nov 20, 2003
- FUJITSU LIMITED
- Naoaki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Naoaki Nakamura

Person

Patents Grantslast 30 patents

Optical fiber mounting method and optical module

Composite bump, method for forming composite bump, and substrate

Optical module and method of manufacturing the same

Optical module

Optical module

Cooling plate and information processing device

Optical module and method of manufacturing optical module

Electronic device, electronic device fabrication method, and electr...

Optical module and method of manufacturing optical module

Cooling device and electronic apparatus

Method for manufacturing thermal interface sheet

Cooling plate and data processing system provided with cooling plates

Stacked three dimensional semiconductor device with in-circuit antenna

Heat sink device and method of repairing semiconductor device

High-sensitive resistance measuring device and monitoring method of...

Reflow soldering apparatus and reflow soldering method

Semiconductor unit and cooling device

Patents Applicationslast 30 patents

OPTICAL FIBER MOUNTING METHOD AND OPTICAL MODULE

BOARD MODULE AND METHOD OF MANUFACTURING BOARD MODULE

OPTICAL MODULE

COOLING PLATE AND INFORMATION PROCESSING DEVICE

OPTICAL MODULE AND METHOD OF MANUFACTURING THE SAME

OPTICAL MODULE

COMPOSITE BUMP, METHOD FOR FORMING COMPOSITE BUMP, AND SUBSTRATE

OPTICAL MODULE

OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE

OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE

ELECTRONIC DEVICE, ELECTRONIC DEVICE FABRICATION METHOD, AND ELECTR...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND ELECTRONIC...

LAMINATED CHIP, LAMINATED-CHIP-MOUNTED SUBSTRATE AND MANUFACTURING...

METHOD FOR MANUFACTURING THERMAL INTERFACE SHEET

COOLING PLATE AND DATA PROCESSING SYSTEM PROVIDED WITH COOLING PLATES

COOLING DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE

THERMAL INTERFACE SHEET AND PROCESSOR

ELECTRONIC DEVICE

METHOD OF DETACHMENT OF CONNECTOR, CONNECTOR DETACHMENT TOOL, AND C...

HEAT SINK DEVICE AND METHOD OF REPAIRING SEMICONDUCTOR DEVICE

HIGH-SENSITIVE RESISTANCE MEASURING DEVICE AND MONITORING METHOD OF...

Semiconductor package, method of production of same, printed circui...

Electronic component package including joint material having higher...

Method of making printed wiring board and method of forming plating...

Reflow soldering apparatus and reflow soldering method