Naofumi Izumi

Person

Itabashi-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing chip with adhesive applied
- Patent number 8,691,666
- Issue date Apr 8, 2014
- Lintec Corporation
- Takeshi Segawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing circuit substrate, and circuit substrate
- Patent number 8,298,873
- Issue date Oct 30, 2012
- Lintec Corporation
- Tatsuo Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Treating method for brittle member
- Patent number 8,113,914
- Issue date Feb 14, 2012
- Lintec Corporation
- Hitoshi Ohashi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
THINNED WAFER MANUFACTURING METHOD AND THINNED WAFER MANUFACTURING...
- Publication number 20220355419
- Publication date Nov 10, 2022
- LINTEC CORPORATION
- Naofumi IZUMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THINNED WAFER MANUFACTURING METHOD AND THINNED WAFER MANUFACTURING...
- Publication number 20220351991
- Publication date Nov 3, 2022
- LINTEC CORPORATION
- Naofumi IZUMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING A SHEET OF A CIRCUIT SUBSTRATE
- Publication number 20120319305
- Publication date Dec 20, 2012
- LINTEC CORPORATION
- Takayuki Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing Chip with Adhesive Applied
- Publication number 20100144120
- Publication date Jun 10, 2010
- LINTEC CORPORATION
- Takeshi Segawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATE
- Publication number 20100044887
- Publication date Feb 25, 2010
- Lintec Corporation
- Tatsuo Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY SUBSTRATE FOR EMBEDDING PIXEL-CONTROLLING ELEMENTS
- Publication number 20100003481
- Publication date Jan 7, 2010
- Masahito Nakabayashi
- G02 - OPTICS
Information Patent Application
TREATING METHOD FOR BRITTLE MEMBER
- Publication number 20080305721
- Publication date Dec 11, 2008
- LINTEC CORPORATION
- Hitoshi OHASHI
- B24 - GRINDING POLISHING
Information Patent Application
Sheet for circuit substrates and sheet of a circuit substrate for d...
- Publication number 20060082002
- Publication date Apr 20, 2006
- LINTEC CORPORATION
- Takayuki Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Naofumi Izumi

Person

Patents Grantslast 30 patents

Method for producing chip with adhesive applied

Method for producing circuit substrate, and circuit substrate

Treating method for brittle member

Patents Applicationslast 30 patents

THINNED WAFER MANUFACTURING METHOD AND THINNED WAFER MANUFACTURING...

THINNED WAFER MANUFACTURING METHOD AND THINNED WAFER MANUFACTURING...

PROCESS FOR PRODUCING A SHEET OF A CIRCUIT SUBSTRATE

Method for Producing Chip with Adhesive Applied

METHOD FOR PRODUCING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATE

DISPLAY SUBSTRATE FOR EMBEDDING PIXEL-CONTROLLING ELEMENTS

TREATING METHOD FOR BRITTLE MEMBER

Sheet for circuit substrates and sheet of a circuit substrate for d...