Naohide Takamoto

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Film for flip chip type semiconductor back surface and its use
- Patent number 10,211,083
- Issue date Feb 19, 2019
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing-tape integrated film for backside of semiconductor and metho...
- Patent number 10,141,217
- Issue date Nov 27, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for back surface of flip-chip semiconductor
- Patent number 9,911,683
- Issue date Mar 6, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for semiconductor back surface and its use
- Patent number 9,768,050
- Issue date Sep 19, 2017
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for semiconductor device production, method for producing film...
- Patent number 9,761,475
- Issue date Sep 12, 2017
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing-tape integrated film for backside of semiconductor and metho...
- Patent number 9,679,797
- Issue date Jun 13, 2017
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet used in manufacture of semiconductor device, adhesiv...
- Patent number 9,620,403
- Issue date Apr 11, 2017
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 9,478,454
- Issue date Oct 25, 2016
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing sheet and method for producing secondary mounted semico...
- Patent number 9,472,439
- Issue date Oct 18, 2016
- Nitto Denko Corporation
- Naohide Takamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Under-fill material and method for producing semiconductor device
- Patent number 9,368,421
- Issue date Jun 14, 2016
- Nitto Denko Corporation
- Kosuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 9,362,156
- Issue date Jun 7, 2016
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing flip-chip type semiconductor device
- Patent number 9,324,616
- Issue date Apr 26, 2016
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for flip chip type semiconductor back surface, dicing tape-int...
- Patent number 9,293,387
- Issue date Mar 22, 2016
- Nitto Denko Corporation
- Yusuke Komoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Manufacturing semiconductor device with film for forming protective...
- Patent number 9,279,064
- Issue date Mar 8, 2016
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laminated film and use thereof
- Patent number 9,202,795
- Issue date Dec 1, 2015
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for back surface of flip-chip semiconductor, dicing-tape-integ...
- Patent number 9,196,533
- Issue date Nov 24, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Under-fill material and method for producing semiconductor device
- Patent number 9,085,685
- Issue date Jul 21, 2015
- Nitto Denko Corporation
- Kosuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for flip chip type semiconductor back surface, dicing tape-int...
- Patent number 9,074,113
- Issue date Jul 7, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface, and pro...
- Patent number 9,050,773
- Issue date Jun 9, 2015
- Nitto Denko Corporation
- Fumiteru Asai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 9,035,466
- Issue date May 19, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for semiconductor device production, method for producing film...
- Patent number 8,986,486
- Issue date Mar 24, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,912,665
- Issue date Dec 16, 2014
- Nitto Denko Corporation
- Miki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for back surface of flip-chip semiconductor
- Patent number 8,896,134
- Issue date Nov 25, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing tape-integrated wafer back surface protective film
- Patent number 8,841,780
- Issue date Sep 23, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing tape-integrated wafer back surface protective film
- Patent number 8,810,044
- Issue date Aug 19, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing tape-integrated wafer back surface protective film
- Patent number 8,766,462
- Issue date Jul 1, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,722,517
- Issue date May 13, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for flip chip type semiconductor back surface
- Patent number 8,704,382
- Issue date Apr 22, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,703,584
- Issue date Apr 22, 2014
- Nitto Denko Corporation
- Sadahito Misumi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,698,324
- Issue date Apr 15, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, PROCESS FOR PRO...
- Publication number 20180346640
- Publication date Dec 6, 2018
- Nitto Denko Corporation
- Goji SHIGA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SHEET, TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170330785
- Publication date Nov 16, 2017
- Nitto Denko Corporation
- Ryuichi KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20170140948
- Publication date May 18, 2017
- Nitto Denko Corporation
- Ryuichi Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE BODY AND COMPOSITE BODY; SEMICONDUCTOR DEVICE MANUFACTURIN...
- Publication number 20170140973
- Publication date May 18, 2017
- Nitto Denko Corporation
- Ryuichi KIMURA
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATED BODY AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170140972
- Publication date May 18, 2017
- Nitto Denko Corporation
- Ryuichi KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED BODY AND COMPOSITE BODY; ASSEMBLY RETRIEVAL METHOD; AND S...
- Publication number 20170140974
- Publication date May 18, 2017
- Nitto Denko Corporation
- Ryuichi KIMURA
- B32 - LAYERED PRODUCTS
Information Patent Application
Underfill Material, Laminated Sheet and Method for Producing Semico...
- Publication number 20170018472
- Publication date Jan 19, 2017
- NITTO DENKO CORPORATION
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE
- Publication number 20160351432
- Publication date Dec 1, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCT...
- Publication number 20160322251
- Publication date Nov 3, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
REAR SURFACE-PROTECTIVE FILM FOR PROTECTING REAR SURFACE OF SEMICON...
- Publication number 20160322252
- Publication date Nov 3, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FILM, FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, A...
- Publication number 20160322272
- Publication date Nov 3, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
REAR SURFACE-PROTECTIVE FILM, FILM, METHOD FOR PRODUCING SEMICONDUC...
- Publication number 20160322308
- Publication date Nov 3, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin C...
- Publication number 20160240523
- Publication date Aug 18, 2016
- NITTO DENKO CORPORATION
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Manufacturing Method
- Publication number 20160240394
- Publication date Aug 18, 2016
- NITTO DENKO CORPORATION
- Akihiro Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Manufacturing Method
- Publication number 20160233184
- Publication date Aug 11, 2016
- Nitto Denko Corporation
- Hiroyuki Hanazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE AND METH...
- Publication number 20160172230
- Publication date Jun 16, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING A SEMICOND...
- Publication number 20160075871
- Publication date Mar 17, 2016
- NITTO DENKO CORPORATION
- Kosuke MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-FILL MATERIAL, SEALING SHEET, AND METHOD FOR PRODUCING SEMICO...
- Publication number 20160064297
- Publication date Mar 3, 2016
- Nitto Denko Corporation
- Kosuke Morita
- B32 - LAYERED PRODUCTS
Information Patent Application
SEALING SHEET, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SUBST...
- Publication number 20160056123
- Publication date Feb 25, 2016
- Nitto Denko Corporation
- Kosuke Morita
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE SHEET USED IN MANUFACTURE OF SEMICONDUCTOR DEVICE, ADHESIV...
- Publication number 20160056066
- Publication date Feb 25, 2016
- NITTO DENKO CORPORATION
- Goji SHIGA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR UNDERFILL, ADHESIVE FILM FOR UNDERFILL INTEGRATED...
- Publication number 20160040045
- Publication date Feb 11, 2016
- Nitto Denko Corporation
- Kosuke MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
REINFORCING SHEET AND METHOD FOR PRODUCING SECONDARY MOUNTED SEMICO...
- Publication number 20160042986
- Publication date Feb 11, 2016
- NITTO DENKO CORPORATION
- Naohide Takamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
UNDERFILL FILM, SEALING SHEET, METHOD OF MANUFACTURING SEMICONDUCTO...
- Publication number 20160035640
- Publication date Feb 4, 2016
- Nitto Denko Corporation
- Kosuke MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD, SHEET-SHAPED RESIN COMPOSIT...
- Publication number 20160013089
- Publication date Jan 14, 2016
- NITTO DENKO CORPORATION
- Naohide Takamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
UNDERFILL SHEET, UNDERFILL SHEET INTEGRATED WITH TAPE FOR GRINDING...
- Publication number 20150380277
- Publication date Dec 31, 2015
- NITTO DENKO CORPORATION
- Kosuke Morita
- B32 - LAYERED PRODUCTS
Information Patent Application
DICING-TAPE INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR AND METHO...
- Publication number 20150364357
- Publication date Dec 17, 2015
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING-TAPE INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR AND METHO...
- Publication number 20150357223
- Publication date Dec 10, 2015
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Under-Fill Material and Method for Producing Semiconductor Device
- Publication number 20150270188
- Publication date Sep 24, 2015
- Nitto Denko Corporation
- Kosuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, METHOD FOR PRODUCING FILM...
- Publication number 20150162236
- Publication date Jun 11, 2015
- Nitto Denko Corporation
- Naohide TAKAMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR DEVICE
- Publication number 20140361443
- Publication date Dec 11, 2014
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS

Naohide Takamoto

Person

Patents Grantslast 30 patents

Film for flip chip type semiconductor back surface and its use

Dicing-tape integrated film for backside of semiconductor and metho...

Film for back surface of flip-chip semiconductor

Film for semiconductor back surface and its use

Film for semiconductor device production, method for producing film...

Dicing-tape integrated film for backside of semiconductor and metho...

Adhesive sheet used in manufacture of semiconductor device, adhesiv...

Dicing tape-integrated film for semiconductor back surface

Reinforcing sheet and method for producing secondary mounted semico...

Under-fill material and method for producing semiconductor device

Dicing tape-integrated film for semiconductor back surface

Method of manufacturing flip-chip type semiconductor device

Film for flip chip type semiconductor back surface, dicing tape-int...

Manufacturing semiconductor device with film for forming protective...

Laminated film and use thereof

Film for back surface of flip-chip semiconductor, dicing-tape-integ...

Under-fill material and method for producing semiconductor device

Film for flip chip type semiconductor back surface, dicing tape-int...

Dicing tape-integrated film for semiconductor back surface, and pro...

Dicing tape-integrated film for semiconductor back surface

Film for semiconductor device production, method for producing film...

Dicing tape-integrated film for semiconductor back surface

Film for back surface of flip-chip semiconductor

Dicing tape-integrated wafer back surface protective film

Dicing tape-integrated wafer back surface protective film

Dicing tape-integrated wafer back surface protective film

Dicing tape-integrated film for semiconductor back surface

Film for flip chip type semiconductor back surface

Dicing tape-integrated film for semiconductor back surface

Dicing tape-integrated film for semiconductor back surface

Patents Applicationslast 30 patents

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, PROCESS FOR PRO...

SHEET, TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

LAMINATE BODY AND COMPOSITE BODY; SEMICONDUCTOR DEVICE MANUFACTURIN...

LAMINATED BODY AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

LAMINATED BODY AND COMPOSITE BODY; ASSEMBLY RETRIEVAL METHOD; AND S...

Underfill Material, Laminated Sheet and Method for Producing Semico...

FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE

FILM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCT...

REAR SURFACE-PROTECTIVE FILM FOR PROTECTING REAR SURFACE OF SEMICON...

INTEGRATED FILM, FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, A...

REAR SURFACE-PROTECTIVE FILM, FILM, METHOD FOR PRODUCING SEMICONDUC...

Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin C...

Semiconductor Device Manufacturing Method

Semiconductor Device Manufacturing Method

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE AND METH...

THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING A SEMICOND...

UNDER-FILL MATERIAL, SEALING SHEET, AND METHOD FOR PRODUCING SEMICO...

SEALING SHEET, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SUBST...

ADHESIVE SHEET USED IN MANUFACTURE OF SEMICONDUCTOR DEVICE, ADHESIV...

ADHESIVE FILM FOR UNDERFILL, ADHESIVE FILM FOR UNDERFILL INTEGRATED...

REINFORCING SHEET AND METHOD FOR PRODUCING SECONDARY MOUNTED SEMICO...

UNDERFILL FILM, SEALING SHEET, METHOD OF MANUFACTURING SEMICONDUCTO...

SEMICONDUCTOR DEVICE PRODUCTION METHOD, SHEET-SHAPED RESIN COMPOSIT...

UNDERFILL SHEET, UNDERFILL SHEET INTEGRATED WITH TAPE FOR GRINDING...

DICING-TAPE INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR AND METHO...

DICING-TAPE INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR AND METHO...

Under-Fill Material and Method for Producing Semiconductor Device

FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, METHOD FOR PRODUCING FILM...

METHOD OF MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR DEVICE