Naohiko Hirano

Person

Okazaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder preform and a process for its manufacture
- Patent number 10,081,852
- Issue date Sep 25, 2018
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,002,841
- Issue date Jun 19, 2018
- Denso Corporation
- Shotaro Miyawaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor substrate and method for manufacturin...
- Patent number 9,269,576
- Issue date Feb 23, 2016
- Denso Corporation
- Shouichi Yamauchi
- C30 - CRYSTAL GROWTH
Information Patent Grant
Solder preform and electronic component
- Patent number 7,800,230
- Issue date Sep 21, 2010
- Denso Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preform and a process for its manufacture
- Patent number 7,793,820
- Issue date Sep 14, 2010
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing mold type semiconductor device
- Patent number 7,468,318
- Issue date Dec 23, 2008
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chip on base through sold...
- Patent number 7,345,369
- Issue date Mar 18, 2008
- Denso Corporation
- Naoki Hirasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat radiation plate and bonding member
- Patent number 7,239,016
- Issue date Jul 3, 2007
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metallic plate with groove
- Patent number 7,235,876
- Issue date Jun 26, 2007
- Denso Corporation
- Tomomi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold type semiconductor device
- Patent number 7,193,326
- Issue date Mar 20, 2007
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer-molded power device and method for manufacturing transfer-...
- Patent number 7,145,254
- Issue date Dec 5, 2006
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided cooling type semiconductor module
- Patent number 7,019,395
- Issue date Mar 28, 2006
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having controlled sur...
- Patent number 6,927,167
- Issue date Aug 9, 2005
- Denso Corporation
- Yutaka Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor power device having heat sinks exposed on one...
- Patent number 6,917,103
- Issue date Jul 12, 2005
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching circuit
- Patent number 6,884,953
- Issue date Apr 26, 2005
- Toyota Jidosha Kabushiki Kaisha
- Yoshibide Nii
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device having a protective film
- Patent number 6,803,667
- Issue date Oct 12, 2004
- Denso Corporation
- Yasushi Okura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor power device having heat sinks exposed on one...
- Patent number 6,787,898
- Issue date Sep 7, 2004
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated gate bipolar transistor
- Patent number 6,384,431
- Issue date May 7, 2002
- Denso Corporation
- Shigeki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170256510
- Publication date Sep 7, 2017
- Shotaro MIYAWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURIN...
- Publication number 20150228482
- Publication date Aug 13, 2015
- Denso Corporation
- Shouichi Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder preform and a process for its manufacture
- Publication number 20110068149
- Publication date Mar 24, 2011
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Preform and Electronic Component
- Publication number 20090236725
- Publication date Sep 24, 2009
- DENSO Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder preform and a process for its manufacture
- Publication number 20080237301
- Publication date Oct 2, 2008
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing mold type semiconductor device
- Publication number 20070158850
- Publication date Jul 12, 2007
- DENSO CORPORATION
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having metallic plate with groove
- Publication number 20070057373
- Publication date Mar 15, 2007
- DENSO CORPORATION
- Tomomi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having semiconductor chip on base through sold...
- Publication number 20060087043
- Publication date Apr 27, 2006
- DENSO CORPORATION
- Naoki Hirasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050167802
- Publication date Aug 4, 2005
- DENSO Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device including electrodes...
- Publication number 20050170555
- Publication date Aug 4, 2005
- DENSO Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050121701
- Publication date Jun 9, 2005
- DENSO Corporation
- Naohiko Hirano
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device having heat radiation plate and bonding member
- Publication number 20050077617
- Publication date Apr 14, 2005
- DENSO Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050073042
- Publication date Apr 7, 2005
- DENSO Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold type semiconductor device and method for manufacturing the same
- Publication number 20040256730
- Publication date Dec 23, 2004
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having controlled surface roughness and method...
- Publication number 20040119088
- Publication date Jun 24, 2004
- DENSO Corporation
- Yutaka Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor power device
- Publication number 20030122232
- Publication date Jul 3, 2003
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030052400
- Publication date Mar 20, 2003
- Yasushi Okura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer-molded power device and method for manufacturing transfer-...
- Publication number 20030022464
- Publication date Jan 30, 2003
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Switching circuit
- Publication number 20030001438
- Publication date Jan 2, 2003
- Yoshihide Nii
- H01 - BASIC ELECTRIC ELEMENTS

Naohiko Hirano

Person

Patents Grantslast 30 patents

Solder preform and a process for its manufacture

Semiconductor device

Silicon carbide semiconductor substrate and method for manufacturin...

Solder preform and electronic component

Solder preform and a process for its manufacture

Method for manufacturing mold type semiconductor device

Semiconductor device having semiconductor chip on base through sold...

Semiconductor device having heat radiation plate and bonding member

Semiconductor device having metallic plate with groove

Mold type semiconductor device

Transfer-molded power device and method for manufacturing transfer-...

Double-sided cooling type semiconductor module

Method for manufacturing semiconductor device having controlled sur...

Molded semiconductor power device having heat sinks exposed on one...

Switching circuit

Semiconductor device having a protective film

Molded semiconductor power device having heat sinks exposed on one...

Insulated gate bipolar transistor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SILICON CARBIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURIN...

Solder preform and a process for its manufacture

Solder Preform and Electronic Component

Solder preform and a process for its manufacture

Method for manufacturing mold type semiconductor device

Semiconductor device having metallic plate with groove

Semiconductor device having semiconductor chip on base through sold...

Semiconductor device

Method of manufacturing a semiconductor device including electrodes...

Semiconductor device

Semiconductor device having heat radiation plate and bonding member

Semiconductor device

Mold type semiconductor device and method for manufacturing the same

Semiconductor device having controlled surface roughness and method...

Semiconductor power device

Semiconductor device

Transfer-molded power device and method for manufacturing transfer-...

Switching circuit