Naohiro KIMURA

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Chiyoda-ku, Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
DICING/DIE-BONDING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20250201618
- Publication date Jun 19, 2025
- Resonac Corporation
- Tsuyoshi TAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BON...
- Publication number 20220216114
- Publication date Jul 7, 2022
- Showa Denko Materials Co., Ltd.
- Tsuyoshi TAZAWA
- H01 - BASIC ELECTRIC ELEMENTS